Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

An end effector for a robotic sanding system includes a sanding head including a sander configured to sand a surface of a workpiece. A motor is operatively coupled to the sander. The motor is configured to rotate the sander to sand the surface of the workpiece. The motor includes a first central longitudinal axis. A coupler is configured to removably secure the end effector to an attachment interface of an arm of the robotic sanding system. The coupler includes a second central longitudinal axis. The first central longitudinal axis is offset from the second central longitudinal axis. One or more sensors are coupled to the sanding head. The one or more sensors are configured to detect presence of a metal within the predefined range.

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

A method for producing a wood sheet that is between 0.6 and 0.8 mm thick, includes covering both surfaces with a matte crystal clear polyester film that is between 70 and 80 micrometres thick joined by thermopressing to the wood sheet. The wood sheet is sanded between the method steps to a thickness ranging from 0.6 to 0.8 mm, a matte polyester film with a thickness ranging from 70 to 80 micrometres is applied, they are then thermopressed at a controlled temperature and speed, and the wood sheet covered with the plastic material film is cold-pressed. The present invention also relates to a translucent wood sheet which allows illumination lamps having unique configurations to be produced.

A grinding robot for grinding an electrically conducting workpiece. The grinding robot includes a grinding wheel, an actuation device for actuating grinding wheel, and a control system. The grinding wheel including an undulated tool receptacle which defines an axis of rotation about which the grinding wheel can rotate during grinding, and a head which is rotationally symmetrical with respect to the axis of rotation, and which contains abrasive material and has a grinding surface which is in contact with workpiece during grinding. The grinding wheel also includes a measuring and transmission unit and at least one conductor strand pair with two conductor strands which are electrically insulated from one another. The conductor strands are embedded in the rotationally symmetrical head and extend from the grinding surface of the head into the interior of the head and are electrically connected with measuring and transmission unit.

A semiconductor manufacturing apparatus is a semiconductor manufacturing apparatus for holding a polishing object on a polishing head and polishing a surface of the polishing object. The semiconductor manufacturing apparatus includes a plurality of laser irradiation parts on the polishing head. At least one of the laser irradiation parts is a laser irradiation part configured to radiate a laser beam toward the back surface side of the polishing object.

A semiconductor manufacturing apparatus is a semiconductor manufacturing apparatus for holding a polishing object on a polishing head and polishing a surface of the polishing object. The semiconductor manufacturing apparatus includes a plurality of laser irradiation parts on the polishing head. At least one of the laser irradiation parts is a laser irradiation part configured to radiate a laser beam toward the back surface side of the polishing object.

A method of strengthening a component made of a metallic material. The method includes subjecting the component to a mechanical grinding process incorporating a relative motion between a tool and the component forming a gradient structure on the surface of the component, resulting in increased tensile strength of the component. A method of strengthening a component made of a TWIP steel. The method includes subjecting the component made of TWIP steel to a mechanical grinding process incorporating a relative motion between a tool and the component forming a gradient structure containing a surface nanolaminate layer, a shear band layer, and an inner deformation twinned layer, resulting in increased tensile strength of the component. A component made of a TWIP steel containing a gradient structure with a surface nanolaminate layer, a shear band layer, and a deformation twinned layer.

A method of strengthening a component made of a metallic material. The method includes subjecting the component to a mechanical grinding process incorporating a relative motion between a tool and the component forming a gradient structure on the surface of the component, resulting in increased tensile strength of the component. A method of strengthening a component made of a TWIP steel. The method includes subjecting the component made of TWIP steel to a mechanical grinding process incorporating a relative motion between a tool and the component forming a gradient structure containing a surface nanolaminate layer, a shear band layer, and an inner deformation twinned layer, resulting in increased tensile strength of the component. A component made of a TWIP steel containing a gradient structure with a surface nanolaminate layer, a shear band layer, and a deformation twinned layer.

Glass, a glass forming method, a pressing apparatus, and a calender. The glass is made by a calendering method, and the glass comprises raw materials of SiO.sub.2, Li.sub.2O, Na.sub.2O, CaO, MgO, Al.sub.2O.sub.3, and TiO.sub.2+ZrO.sub.2. The pressing apparatus comprises two oppositely arranged pressing mechanisms; each pressing mechanism comprises a base, a cross beam, a pressing rod, a stand column, and a driving mechanism; the stand column and the driving mechanism are mounted on the base; the first end of the pressing rod, the end of the stand column distant from the base, and the end of the driving mechanism distant from the base are all pivoted to the cross beam; and the stand column is located between the pressing rod and the driving mechanism. The calender comprises the pressing mechanisms. The glass has better performance and higher mechanical strength.