A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

A substrate processing apparatus includes a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrate is performed; a tilt angle adjusting device configured to adjust a tilt angle of the substrate chuck with respect to the rotary table at the processing position; and a tilt angle controller configured to control the tilt angle adjusting device based on a measurement result of a plate thickness measuring device. The plate thickness measuring device measures a plate thickness of the substrate at the carry-out position.

A substrate processing system configured to process a substrate includes a carry-in/out unit configured to carry the substrate from/to an outside thereof; a processing unit configured to process a processing surface of the substrate; a cleaning unit provided between the carry-in/out unit and the processing unit when viewed from a top, and configured to clean the processing surface after being processed in the processing unit; a first transfer unit stacked on top of the cleaning unit, and configured to transfer the substrate; and a second transfer unit provided between the processing unit and the first transfer unit when viewed from the top, and configured to transfer the substrate. The first transfer unit transfers the substrate between the carry-in/out unit and the second transfer unit. The second transfer unit transfers the substrate between the first transfer unit and the processing unit and between the processing unit and the cleaning unit.

A mobile machine tool for processing a surface of a workpiece or a room, wherein the machine tool includes a working device with a plate tool for processing the surface and a drive motor for driving the plate tool, which tool has a processing surface assigned to processing a workpiece and a machine side opposite to the processing surface, wherein intake air inflow openings are arranged on the surface to be processed for suctioning the processing surface onto the surface to be processed, which openings are flow-connected to at least one intake air outflow opening arranged on the plate tool away from the processing surface, wherein the plate tool includes at least one additional air inflow opening for the inflow of additional air, which is flow-connected to at least one additional air outflow opening arranged away from the processing surface, and wherein the machine tool includes an intake device for generating an intake air flow and/or a negative pressure at the at least one intake air outflow opening and the at least one additional air outflow opening.

A mobile machine tool for processing a surface of a workpiece or a room, wherein the machine tool includes a working device with a plate tool for processing the surface and a drive motor for driving the plate tool, which tool has a processing surface assigned to processing a workpiece and a machine side opposite to the processing surface, wherein intake air inflow openings are arranged on the surface to be processed for suctioning the processing surface onto the surface to be processed, which openings are flow-connected to at least one intake air outflow opening arranged on the plate tool away from the processing surface, wherein the plate tool includes at least one additional air inflow opening for the inflow of additional air, which is flow-connected to at least one additional air outflow opening arranged away from the processing surface, and wherein the machine tool includes an intake device for generating an intake air flow and/or a negative pressure at the at least one intake air outflow opening and the at least one additional air outflow opening.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A machine (10) for grinding and/or polishing slabs of stone material, such as natural or agglomerated stone, ceramics or glass, comprises: a support bench (12) for the slabs to be machined. At least one working station (14) is provided above the support bench (12), said station comprising at least one pair of bridge support structures (16, 18) situated opposite each and arranged transversely on either side of the support bench (12). First means (19) are provided for performing a relative movement in the longitudinal direction of machining station (14) and slab on the support bench (12). The machine further comprises at least one beam (20, the two ends (22, 24) of which are supported by the support structures (16, 18), and at least one rotating spindle (26) with a sliding vertical axis mounted on the at least one beam (20). The beam (20) is movable transversely on the support structures (16, 18). The bottom end of the spindle (26) is provided with at least one tool-carrying support (28) rotating about the axis of rotation of the spindle (26). The machine is characterized in that it comprises second means (32) for performing a relative movement in the longitudinal direction of the at least one spindle (26) with respect to the support bench (12).