A deburring device includes a cylindrical body with a receptacle for receiving a pipe. The cylindrical body includes an abrasive surface provided in the receptacle, which is configured to simultaneously deburr at least two surfaces of a pipe inserted into the receptacle.

Provided is a processing tool capable of sliding a tool relative to a shank with a simple structure, to which a tool holder is detachably attached. The processing tool to which the tool is detachably attached, includes: a body; a spindle including tool holder holding hole, a first anti-rotation body holding hole; a cover including a pressing surface and a relief portion; a tool holder detachably inserted into the tool holder holding hole, the tool holder including a first anti-rotation groove, a tool holding hole, and a first spring holding hole, an anti-rotation body movable between the first anti-rotation groove and the pressing surface, the anti-rotation body accommodated in the relief portion when the cover is located at the detachable position and the tool holder is removed from the tool holder holding hole; and an elastic member to urge the tool holder toward distal end.

A deburring device includes a cylindrical body with a receptacle for receiving a pipe. The cylindrical body includes an abrasive surface provided in the receptacle, which is configured to simultaneously deburr at least two surfaces of a pipe inserted into the receptacle.

An apparatus for selectively removing material from both an inner and outer circumference of an end of a tubular workpiece includes a cylindrical outer frame. A blade holder is affixed to the outer frame. The blade holder has a conical configuration with a base located adjacent a first rim of the outer frame and an apex located adjacent a second rim of the outer frame. At least one ID blade is carried by the blade holder and has an ID cutting edge oriented radially outward. At least one OD blade is carried by the blade holder and has an OD cutting edge oriented radially inward. A motive cap has a rim-coupling feature configured for selective engagement sequentially with the first and second rims of the outer frame, to selectively provide rotational motion to the outer frame and thus indirectly to the blade holder.

The edge sanding device may be a tool for sanding an edge of a workpiece. The workpiece may be moved through a cabinet from an infeed to an outfeed by a conveyance. The workpiece may pass one or more edge sanding stations as the workpiece moves through the cabinet. As the workpiece passes an individual edge sanding station selected from the one or more edge sanding stations, the individual edge sanding station may move an orbital sander from a quiescent position to a sanding position thus pressing a sanding disk of the orbital sander against the edge of the workpiece to sand the edge. In some embodiments, the edge sanding device may further comprise one or more finishing stations to smooth corners of the workpiece.

A finger includes a pair of overhanging portions that project out laterally from a main body portion. Outer peripheral surfaces of the overhanging portions are made up from five surfaces including upper surfaces, side surfaces, lower surfaces, first end surfaces, and second end surfaces. Crowning is applied to the intersections between these surfaces.

A servo driven compliant mechanism is provided. The servo driven compliant mechanism includes a holder, a first pivot, a grinding tool, a posture sensor, a displacement sensor, an inner frame, and a first servomotor. The first pivot is perpendicular to an axial direction of the grinding tool. The posture sensor is used for sensing a posture of the grinding tool and sending a posture signal to be transformed into a torque compensation value for an effect of gravity. The displacement sensor is used for sensing a displacement of the grinding tool along the first pivot. The grinding tool is disposed in the inner frame, and the first pivot is movably disposed in the inner frame. The first servomotor is disposed in the inner frame and drives the grinding tool to rotate along the first pivot according to the torque compensation value and the displacement.

A manufacturing method of a wafer with a notch includes: polishing principal surfaces of the wafer; mirror-polishing a notch chamfered portion of the notch; mirror-polishing an outer-periphery chamfered portion of an outer peripheral portion of the wafer; and finish-polishing one of principal surfaces of the wafer, the finish-polishing being performed after performing the mirror-polishing of the notch chamfered portion, the polishing of the principal surfaces, and the mirror-polishing of the outer-periphery chamfered portion in this order.

A polishing system for polishing a workpiece includes a sensor group detecting pressure information of the workpiece and generating a pressure sequence; a processor coupled to the sensor group and configured to: receive the pressure sequence; generate indication information including a predetermined track of a polishing head to polish the workpiece; based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and based on the deviation sequence, generate an adjustment instruction, to adjust a position of the polishing head. A polishing method, an assistant polishing device, an assistant polishing system, and an assistant polishing method are also disclosed.

A polishing system for polishing a workpiece includes a sensor group detecting pressure information of the workpiece and generating a pressure sequence; a processor coupled to the sensor group and configured to: receive the pressure sequence; generate indication information including a predetermined track of a polishing head to polish the workpiece; based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and based on the deviation sequence, generate an adjustment instruction, to adjust a position of the polishing head. A polishing method, an assistant polishing device, an assistant polishing system, and an assistant polishing method are also disclosed.