Method and apparatus for sharpening a cutting tool. In some embodiments, a sharpener has a guide assembly adjacent a moveable abrasive medium. The medium is advanced at a first speed relative to the guide assembly during a coarse sharpening operation in which a user presents the cutting tool against the medium to shape a side of the cutting tool and generate distended material from the cutting edge (e.g., burrs). The medium is subsequently slowed to a lower, second speed for a fine sharpening operation in which the user presents the cutting tool against the medium to remove the distended material and provide a sharpened cutting edge.

A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.

A belt-finishing device including a frame. A pressing arm is configured to pivotally mount on the frame. A pressing element, which is used to press a finishing belt against a workpiece surface to be treated, is arranged on the pressing arm. The device is provided with a position detection system for detecting a pressing-arm actual position that deviates from a desired position of the pressing arm. A malfunction or defect of the pressing element is detected by means of the pressing arm actual position that deviates from the desired position of the pressing arm.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A removal structure for a central shaft of a sanding belt is fixed on a grinding machine, and the grinding machine contains: a driver, a driving shaft mounted on a top of the driver, a fitting sleeve extending outwardly from a central position of the driving shaft, a conical groove defined in the fitting sleeve, and at least one L-shaped notch formed on a peripheral wall of the fitting sleeve. A connection column is fitted with the driving shaft and includes a central shaft formed in a cone shape so as to correspond to the conical groove of the fitting sleeve, and the central shaft has at least one locking post corresponding to the at least one L-shaped notch.

A removal structure for a central shaft of a sanding belt is fixed on a grinding machine, and the grinding machine contains: a driver, a driving shaft mounted on a top of the driver, a fitting sleeve extending outwardly from a central position of the driving shaft, a conical groove defined in the fitting sleeve, and at least one L-shaped notch formed on a peripheral wall of the fitting sleeve. A connection column is fitted with the driving shaft and includes a central shaft formed in a cone shape so as to correspond to the conical groove of the fitting sleeve, and the central shaft has at least one locking post corresponding to the at least one L-shaped notch.

An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magnetorheological polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to selectively apply a magnetic field in a vicinity of the surface, and at least one holder placed in opposing relation to the surface, the at least one holder being configured to support at least one article such that an edge of the at least one article can be selectively immersed in the MPF ribbon delivered to the at least one well.

A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.

The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

A blade for a skate for skating on ice. The blade includes ice-contacting material with an ice-contacting surface for contacting the ice. The ice-contacting surface has a machined longitudinal profile with a radius of curvature that varies smoothly over a majority of the length of the blade. Such a radius of curvature may, in some cases, be an elliptical arc.