A wheel grinder contains: a body, a work table, a vertical limitation frame, a movable adjustment portion configured to move vertically, a grinding wheel portion extending outward from the movable adjustment portion, and a motor fixed on the movable adjustment portion. The vertical limitation frame has two fixing holders, two mountings, and two first screw rods and two second screw rods which are inserted through the two mountings respectively and abut against a bottom of the movable adjustment portion. In addition, a stop cover is covered on the grinding wheel portion and includes a defining plate configured to define a connection shaft and an opening inside the defining plate.

Apparatuses and associated methods for polishing side surfaces of fibers. The system includes a fiber loading mechanism for securing a fiber to the apparatus, a polishing mechanism, and a linear motion mechanism for linearly translating one of the polishing mechanism and the fiber for polishing a side surface of the fiber using the polishing mechanism.

A grinding machine for grinding a surface of an object is described which has a plurality of grinding brushes which are rotatably mounted about a brush axis of rotation, at least one brush carrier on which at least one of the grinding brushes is mounted and which is rotatably mounted about a carrier axis of rotation, and a conveying device for conveying the object at a feed speed through the grinding machine. The grinding machine has an input device and an output device. A brush rotational speed about the brush axis of rotation and/or a carrier rotational speed about the carrier axis of rotation and/or the feed speed is/are adjustable by the input device, and an expected grinding result can be output by the output device.

An object is to enable accurate machining by enabling shots to be accurately blasted on a workpiece even while workpiece is being deformed. A part manufacturing system includes: a peening device including a nozzle that projects a plurality of shots toward a workpiece, and a sensor that detects a distance to the workpiece; and a machining robot including a hand to which the peening device is attached, and a control unit that adjusts a position or an orientation of the peening device by controlling the hand based on the distance detected by the sensor.

The present disclosure discloses an integrated rotary cutting tool manufacturing device and method, the integrated rotary cutting tool manufacturing device comprises a workpiece transfer device, a machine body, a feeding device, grinding devices and a discharge device. The grinding devices comprise a rough grinding device used for carrying out primary grinding on a vertically arranged workpiece and a fine grinding device used for carrying out secondary grinding on the vertically arranged workpiece. The integrated rotary cutting tool manufacturing device is adopted by the rotary cutting tool manufacturing method. The device according to the present disclosure is compact in structure, high in machining efficiency and precision, and low in costs, the maximum values, the minimum values and the average values of the roundness and the concentricity of machined micro drill bits are closer to the standard values, and the stabilization process capability indexes of the roundness.

Provided is an optical fiber ferrule polishing jig capable of fixing an optical fiber ferrule and releasing the optical fiber ferrule. An optical fiber ferrule polishing jig 10A has; a base 12a having insertion holes 20 into which optical fiber ferrules 51 can be detachably inserted; pivoting rods 13 which are adjacent to the insertion holes 20 of the base 12a and rotatable around lower end portions 36; fixing pieces 14a installed in installation recesses 19a formed in the base 12a to fix the optical fiber ferrules 51 with respect to the insertion holes 20 by being moved as the rods are pivoted; and a plurality of coil springs 15a installed in the installation recesses 19a to bias the fixing pieces 14a so as to release fixing of the optical fiber ferrules 51 with respect to the insertion holes 20.

Disclosed is a device for removing burrs from an aluminum alloy hub. The device includes a workbench, columns, a brush, a spindle, a spindle box, a cross beam, a spindle motor, a controller, a parallel robot, and a displacement sensor. Columns are fixedly connected to the workbench, and the cross beam is connected to the columns and a position of the cross beam can be adjusted along the columns; the spindle box is connected to the cross beam, and moves horizontally on the cross beam; the spindle, the spindle motor and the controller are mounted on the spindle box, and the brush is mounted at the end of the spindle; the brush is driven to rotate by the spindle motor and controlled by the controller; and the displacement sensor is mounted in the brush. The parallel robot can implement precise adjustment, and can perform real-time posture adjustment according to the instruction of the controller to ensure that the brush is always in close contact with the back cavity of the hub.

An apparatus is provided for texturing a work surface comprised of aggregate, that includes: a texturing carriage; a carriage rotation device coupled to the texturing carriage and configured to selectively rotate the texturing carriage; a vertical frame member configured to guide the texturing carriage or the carriage rotation device, or both, in a vertical direction in relation to a surface on which the apparatus rests. Alternately, the apparatus can include: a texturing carriage, the texturing carriage including a texturing head configured to hold one or more texturing pads and a texturing head motor, the texturing head motor configured to move the one or more texturing pads across a work surface, the texturing carriage configured to extend and retract the texturing head towards and away from the work surface.

A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.

An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first portion and a second portion opposed to the first portion. The first portion is configured to rotatably connect to the support and pivot the elongated member about the axis of rotation relative to the support through an angle of rotation that is at least about 270 degrees in a single direction. The apparatus includes a carrier head configured to connect to the second portion and to hold and process a substrate.