A method of preparing individual spectacle lenses (L) in accordance with a prescription order comprises the steps of: (i) blocking, a provided lens blank (LR) as workpiece on a block piece provided from a plurality of block pieces (B) from a block piece store (BL), (ii) processing the blocked lens blank at least at a second surface so as to obtain a blocked, processed spectacle lens (L) as workpiece, and (iii) deblocking the processed spectacle lens from the block piece, wherein the workpiece, optionally in the blocked state, is transported between the steps (i) to (iii) in one of a plurality of provided transport boxes (T). In the method, the block pieces prior to the step (i) of blocking are stored in the transport boxes in the block piece store and, for the step (i) of blocking, are provided in the transport boxes from the block piece store.

One exemplary embodiment relates to a device for the robot-assisted machining of surfaces. According to one example, the device has a carrier structure, a motor, a linear actuator, and a machining head. The machining head is coupled to the carrier structure by means of the linear actuator and has a drive shaft for directly or indirectly driving a rotatable tool. The device also has a flexible shaft, which couples a motor shaft of the motor to the drive shaft of the machining head.

A method, an installation and a system for processing optical workpieces in which workpieces are conveyed to individual processing apparatus or processing lines corresponding to an assignment. The respective assignment preferably takes into consideration assignment parameters, such as the availability and capability of processing apparatus and/or processing lines. The assignment that already has been carried out is examined before the actual or ultimate conveying and/or when there is a change in the assignment parameters and optionally is changed in a corresponding manner, taking into consideration the current assignment parameters, in order to adapt to current circumstances. As an alternative or in addition, jobs for processing workpieces are forwarded to the processing installations at different sites based on corresponding assignment parameters. Optionally, an examination and, as appropriate, a change in the assignment are made when new jobs or significant changes in the assignment parameters are detected.

A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.

A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.

Disclosed is an apparatus for the batch polishing of workpieces, the apparatus includes an annular cavity, in which several workpieces are mounted, magnetic abrasives, which are arranged in the annular cavity and used for polishing the workpieces, and multiple magnet sets, which are used for generating a magnetic field for the magnetic abrasives in order to remove a surface material of the workpieces, wherein each of the magnet sets comprises magnets arranged on both inner and outer sides of the annular cavity and configured to rotate about the axis of the annular cavity.

A polishing machine with an automatic feed and discharge function includes a machine frame, a clamping mechanism, a polishing shaft, a feed mechanism and a discharge mechanism. The clamping mechanism, the discharge mechanism, the polishing shaft and the feed mechanism are mounted on the machine frame. Multiple polishing heads are mounted on the polishing shaft. The feed mechanism includes a feed frame, a sliding platform, a sliding drive member, multiple columns of storage mechanisms for storing polishing pads, and multiple columns of push mechanisms, and the number of the columns of the storage mechanisms matches the number of the columns of the push mechanisms. The feed frame is mounted on the machine frame. The sliding platform is slidably arranged on the feed frame. The storage mechanisms are mounted on the sliding platform. The push mechanisms are mounted on the feed frame and are located above the storage mechanisms.

One exemplary embodiment relates to an installation and a method for processing ophthalmic lenses, with several processing devices for processing the lenses. The embodiment includes a conveying device connecting the processing devices for transporting lens carriers to and from the processing devices, and with a transfer device for changing transport tracks as required. According to the embodiment, it is provided that the processing devices are arranged in front of the first transport track and that the transfer device is designed as a pushing device with a fork-shaped guide device which guides the lens carriers laterally and in the direction of conveyance.

An automated gem polishing system comprising a computer-controlled polishing wheel; robotic apparatus, comprising multiple axis controllers and a gem holder; a digital microscope; and a computer having a processor and a memory, the memory including instructions that when executed by the processor implement the steps of registering and polishing a gem in the gem holder.

One object is to improve the uniformity of polishing of a substrate. The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.