A masking tool system includes a first masking body and a second masking body. The first masking body includes a bore passing through a portion of the first masking body and a first sealing element disposed on a first end of the first masking body. The second masking body includes a bore passing through the second masking body and a second sealing element disposed on a first end of the second masking body. The system may also include a rod configured to pass through the bores of the first and second masking bodies and to secure the first and second masking bodies to a metallic article placed therebetween. A diagonal length of the masking tool system induces a wobbling rotation during processing.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 in.

The present invention relates to a knee joint prosthesis having a tibial component and a femoral component. The tibial component includes a fixation portion fixed to an upper end of a prepared tibia and a ceramic bearing portion presenting articulation surface(s). The femoral component is fixed to a lower end of a prepared femur and comprises a ceramic body portion presenting articulation surface(s). The respective articulation surfaces of the tibial and femoral components are configured for essentially congruent engagement over a full range of movement of the prosthesis, and the bearing portion of the tibial component is adapted for movement relative to the fixation portion. Also disclosed is an apparatus and a method for finishing articulation surfaces of ceramic components of a knee joint prosthesis, including the steps of combining the ceramic bearing portion and the ceramic body portion, and imparting relative movement to the bearing portion and/or the body portion.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A fixture assembly includes a frame with a tip rail displaced from a main body. A method of polishing a gas turbine engine component includes restricting a flow of media adjacent to a tip of a component with an airfoil to be generally equal to a flow of media adjacent to a sidewall of the airfoil.

Magnetic apparatuses and systems for shaping parts are described. One or more magnets can be used to direct a magnetically responsive fluid having magnetically responsive particles around surfaces of a part. The magnetically responsive fluid can include abrasive particles that follow movement of the magnetically responsive fluid across surfaces of the part and remove material from the part until the part takes on a desired shape. The magnetic apparatuses can be configured to provide a rough cut, similar to machining process, and/or a fine cut, similar to polishing or buffing process, to the part.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A sphere precision machining device and a machining method comprise a cavity, an abrasive grain stream, and a circulation device. The cavity holds the workpiece, and comprises two hollow hemispheres, each of said two hemispheres being provided with a main flow channel. Said main flow channel is connected to the cavity. One end of the main flow path of each of the two said hemispheres is connected to a circulating means by which a stream of abrasive grains is made to grind the workpiece. A plurality of main flow channels are disposed homogeneously inside the hemisphere, each of said main flow channels being provided with a plurality of branch flow channels connected to the cavity, said branch flow channels tapering in the flow direction. The present disclosure uses the difference in abrasive grain flow pressure on the surface of the workpiece to achieve precision machining.

A sphere precision machining device and a machining method comprise a cavity, an abrasive grain stream, and a circulation device. The cavity holds the workpiece, and comprises two hollow hemispheres, each of said two hemispheres being provided with a main flow channel. Said main flow channel is connected to the cavity. One end of the main flow path of each of the two said hemispheres is connected to a circulating means by which a stream of abrasive grains is made to grind the workpiece. A plurality of main flow channels are disposed homogeneously inside the hemisphere, each of said main flow channels being provided with a plurality of branch flow channels connected to the cavity, said branch flow channels tapering in the flow direction. The present disclosure uses the difference in abrasive grain flow pressure on the surface of the workpiece to achieve precision machining.

A method of manufacturing an actuator assembly component is provided. The method includes tumble polishing the actuator assembly component. The method also includes taking at least one bearing ratio measurement along a portion of a surface of the actuator assembly component. The method further includes comparing the at least one bearing ratio measurement to a minimum bearing ratio value to verify that the actuator assembly component has been tumble polished.