A polishing device and a polishing method. The polishing device includes a thrust system, a sealing system including a piston, a cylinder body matched with the piston, and the cylinder body accommodating a polishing medium for polishing; a conveying pipeline system conveys the polishing medium to one end of an inner flow channel workpiece for polishing; a recycle system including a recycle container, a recycle pipeline, a return pipeline, a driving assembly, and a control valve assembly, the control valve assembly includes a first valve, a second valve; the recycle container is connected with the workpiece through the recycle pipeline, and the sealing system is communicated with the workpiece through the return pipeline; the first valve is coordinated with the sealing system and a low-pressure environment, the second valve is located at the return pipeline, is coordinated with the recycle container and the sealing system.

Disclosed is an electrochemical polishing method employing solid electro-conductive media with bi-directional planetary motion, mainly including the following steps: using solid particles absorbing an electrolyte as solid electro-conductive media, and submerging an anode (workpiece) in the solid electro-conductive media to perform bi-directional planetary motion during polishing, allowing the workpiece to fully contact and collide with the solid electro-conductive media, and ensuring that materials are uniformly removed from various surfaces of the workpiece. In the present disclosure, one-time overall polishing of complex-shaped workpieces can be achieved by bi-directional planetary motion of the workpieces, the consistency of material removal from various surfaces of the workpieces is improved, and the polishing performance and efficiency are enhanced.

A displacement magnifying mechanism, polishing device, actuator, electronic component processing apparatus, dispenser, and air valve which can easily control a drive system. The displacement magnifying mechanism includes a base; a piezoelectric element of which an end is attached to a mounting surface of the base, the piezoelectric element extending along a first longitudinal direction; a support member of which an end is attached to the mounting surface side by side with the piezoelectric element, the support member extending along a second longitudinal direction which intersects with the first longitudinal direction; an operating portion attached to each of other ends of the piezoelectric element and the support member to allow the operating portion to be displaced, in response to an expansion/contraction of the piezoelectric element, along a displacement direction; and a compression member attached to the base and the operating portion so as to compress the piezoelectric element.