A device for holding in position a product to be processed includes a base connectable by magnetic interaction to a work surface of an apparatus for tumbling or polishing and comprising a first portion and a second portion movable along an operating direction mutually towards or away from a first and a second operating position. The device also includes a retaining support connected to the base and configured to hold in a stable position a product to be processed between a first and a second retaining element. Between the first and the second portion of the base an actuation member is interposed, configured to move the same portions between the first operating position and the second operating position. A method for holding in position a product to be processed is also disclosed.

A method for manufacturing a display device includes forming a first gate metal wire on a substrate, forming a first insulation layer that covers the first gate metal wire, forming a second gate metal wire on the first insulation layer, forming a second main insulation layer that covers the second gate metal wire, forming a second auxiliary insulation layer on the second main insulation layer, forming an exposed portion of an upper surface of the second main insulation layer by polishing the second auxiliary insulation layer, and forming a first data metal wire on the second main insulation layer and the second auxiliary insulation layer.

A method for manufacturing a display device includes forming a first gate metal wire on a substrate, forming a first insulation layer that covers the first gate metal wire, forming a second gate metal wire on the first insulation layer, forming a second main insulation layer that covers the second gate metal wire, forming a second auxiliary insulation layer on the second main insulation layer, forming an exposed portion of an upper surface of the second main insulation layer by polishing the second auxiliary insulation layer, and forming a first data metal wire on the second main insulation layer and the second auxiliary insulation layer.

A method of processing a surface in additive manufacturing includes assembling a structure for a component by additive manufacturing out of a bed of a powdery base material, such that the structure is provided with an internal surface and a powdery base material covers at least a part of the internal surface, and actuating the base material relatively to the structure such that the internal surface is mechanically processed by the base material.

A method of providing an abrasive structure for additive manufacturing includes determining of a design of a portion of a powdery base material and selectively solidifying the portion in a bed of the base material according to the determined design such that an abrasive structure is generated, wherein the abrasive structure is still movable in the bed of the base material. Further, an additively manufactured component has an internal surface with a surface roughness of less than 100 m, preferably less than 60 m.

A method of providing an abrasive structure for additive manufacturing includes determining of a design of a portion of a powdery base material and selectively solidifying the portion in a bed of the base material according to the determined design such that an abrasive structure is generated, wherein the abrasive structure is still movable in the bed of the base material. Further, an additively manufactured component has an internal surface with a surface roughness of less than 100 m, preferably less than 60 m.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A system for screening deburring media during deburring operations of a hardware part comprises a deburring machine comprising a media slurry basin, a deburring media slurry disposed in the media slurry basin, and a media screening device freely movable within the deburring media slurry to define a dynamic zone of capture to capture noncompliant media. The media screening device can comprise a housing defining an inner chamber, and can comprise a plurality of openings each sized to restrict compliant deburring media from passing through the opening, and each opening sized to permit passage of noncompliant deburring media into the inner chamber. Each opening can comprise a counterbore. The media screening device can comprises at least one removable housing body removably coupled to the housing to facilitate removal of captured noncompliant deburring media. A method is disclosed for screening deburring media during deburring of a hardware part.

Aspects of the present disclosure are presented for techniques in removing roughness and surface anomalies in structures with internal passages and intricate external surfaces, such as structures with internal fluid passages constructed by additive manufacturing (AM), using an abrasive slurry. Post processing methods which are capable of smoothing non-uniform surface roughness within intricate fluid passages are a prerequisite to the widespread adoption of AM for complex fluid systems. In some embodiments, a mixture of abrasive powder and deionized (DI) water is used to create a viscous slurry which can then be pumped through the internal fluid passages of a workpiece until the desired surface roughness is achieved. This abrasive flow machine (AFM) is capable of smoothing a wide range of roughnesses, internal geometries, and printable materials.

A method for manufacturing a display device includes forming a first gate metal wire on a substrate, forming a first insulation layer that covers the first gate metal wire, forming a second gate metal wire on the first insulation layer, forming a second main insulation layer that covers the second gate metal wire, forming a second auxiliary insulation layer on the second main insulation layer, forming an exposed portion of an upper surface of the second main insulation layer by polishing the second auxiliary insulation layer, and forming a first data metal wire on the second main insulation layer and the second auxiliary insulation layer.