A method of removing material from a surface of an ultrasound directing element comprising a plastic material is provided. The method includes mounting the ultrasound directing element to a mounting block of a sanding apparatus. The mounting block includes an engagement member that moves from a release position to an engagement position thereby engaging the ultrasound directing element. The mounting block is moved along a base of the sanding apparatus bringing a surface of the ultrasound directing element into contact with a sanding surface. Material is removed from the surface of the ultrasound directing element using the sanding surface.

A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory computer-readable medium and executed by the processor.

The invention relates to a machining device (1), in particular a CNC machining device, for machining preferably planar workpieces (W) that are preferably composed of wood, wood material, plastic, and/or glass at least in parts, comprising: a machining assembly, which has a dynamic element; a first guide assembly, by means of which the machining assembly can be moved in a spatial direction; and at least one vibration-damping device. Vibrations of the dynamic element (3) can be passively damped by means of the at least one vibration damper device.

An integrated equipment for processing a plurality of fiber optic ferrules comprises a polishing system, a ferrule cleaning system, a drying system, a wiping system, and a robot system. The polishing system polishes a plurality of front end faces of the plurality of fiber optic ferrules mounted on a carrier. The ferrule cleaning system cleans the carrier and the fiber optic ferrules on the carrier after the fiber optic ferrules have been polished. The drying system dries the carrier and the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been cleaned. The wiping system wipes the front end faces of the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been dried. The robot system transfers the carrier to the polishing system, the ferrule cleaning system, the drying system, and the wiping system.

Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.

A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around multiple grooved rollers, the method including feeding a workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at multiple positions aligned in an axial direction of the workpiece simultaneously. The method includes: supplying a coolant for workpiece slicing onto the wire row when the workpiece is sliced with the fixed abrasive grain wire; and supplying a coolant for workpiece drawing, which differs from and has a higher viscosity than the coolant for workpiece slicing, onto the wire row when the workpiece is drawn out from the wire row after the slicing of the workpiece.

A power tool includes a housing, an auxiliary handle, and a vibration damping assembly. The auxiliary handle includes a front end and a gripping portion. The vibration damping assembly includes a mass member and an elastic element. The auxiliary handle further includes an end cap arranged at a rear end of the gripping portion where the rear end is far away from the housing relative to a front end of the gripping portion. An accommodating cavity for accommodating the vibration damping assembly is formed around the gripping portion. The elastic element is arranged between a mass member and a cavity wall of the accommodating cavity. A ratio of a natural frequency W1 of the vibration damping assembly to a rotation frequency W2 of an output shaft in rotation is greater than or equal to 0.7 and less than or equal to 1.3.

The present invention relates to a device for integrally processing a housing of a Computing, Communication, and Consumer (3C) product. The device includes a loading frame and an upper frame, where a material receiving device is arranged in the loading frame, a width of the loading frame is greater than that of the housing, a grinding device is arranged below the upper frame, and the grinding device includes a grinding movement device; the grinding movement device is connected to a grinding installation block, an outer side of the grinding installation block is provided with grinding lifting balls, a grinding arc block is embedded in an inner side of an upper portion of the grinding installation block, and the upper frame is also provided with a material pressing device. An outer side of the loading frame is provided with a feeding and discharging device.

A rectifier circuit for rectifying an AC voltage supplied from a commercial power supply into a DC voltage, a smoothing capacitor for smoothing the output of the rectifier circuit, and an electrically powered tool for supplying the smoothed pulsating DC voltage to a motor by an inverter circuit, wherein when the motor is driven while no load is being applied to a tip tool, the smoothed DC voltage repeatedly generates a maximal value and a minimum value so as to synchronize with the fluctuation in the AC voltage. During no-load rotation, control is performed so that driving is performed at a value that is less than a threshold value D.sub.1 for the duty ratio at which the generation of a gear sound starts in any of the speed dial setting values 1-6. It is thereby possible to suppress a gear sound generated by a power transmission mechanism during no-load rotation.

A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.