The invention relates to a machine tool for robot-assisted surface finishing. According to one embodiment, the machine tool comprises a first support plate and a second support plate. The first support plate is designed for mounting on a manipulator. An output shaft for receiving a rotatable tool is mounted on the second support plate. The machine tool additionally comprises a linear actuator that acts between the first support plate and the second support plate, as well as a motor which is mounted on the first support plate. The machine tool additionally comprises a telescopic shaft with a first shaft portion and a second shaft portion that can be displaced relative to said first shaft portion. The first shaft portion is coupled to a motor shaft of the motor, and the second shaft portion as mounted on the second support plate. The telescopic shaft is coupled to the output shaft by means of a gear mechanism.

The present disclosure provides a carbide blade grinding forming processing production line, relates to the field of blade processing in forming, and provides a production line for grinding forming processing of a carbide blade with inscribed circular holes, which has functions of blade grinding forming processing, blade cleaning and drying and detection of external dimension of a formed blade, and has an automatic loading and uninstalling function. In most processing course of the blade, the cutter head is taken as a carrier, and an overturning device is configured to overturn a whole cutter die box, such that integral end surface overturning of the cutter head in the cutter die box after single end surface grinding is realized, and blade filling processes in different processing links are reduced.

A polishing apparatus is provided with a machining head that is supported to freely move in two horizontal directions; driving devices that enables the machining head to move; a polishing jig that is supported by the machining head to freely move in a vertical direction; a polishing member that is mounted on a lower end portion of the polishing jig; an air cylinder polishing jig moving device that moves the polishing jig and is capable of pressing the polishing member against a tube support plate; and a drive motor that is capable of rotating the polishing jig, thus, simplification of the structure is made possible.

An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens includes: a lens chuck shaft configured to chuck the eyeglass lens; a shaft angle changing portion configured to change a shaft angle of the lens chuck shaft; a first processing tool unit including at least one spindle at which a first processing tool is provided; a second processing tool unit that is disposed to oppose the first processing tool unit and that includes at least one spindle at which a second processing tool is provided; and a controller configured to change one of the first and second processing tool unit to be used for processing the eyeglass lens to the other of the first and second processing tool by controlling driving of the shaft angle changing portion to change the shaft angle of the lens chuck shaft.

A gripper apparatus for loading workpieces to a grinding system includes a mount, a gas-supply coupler, a gas manifold, pneumatic cylinders, and grippers. The gas-supply coupler is supported by the mount and has a first end that detachably mates with a corresponding coupler attached to an external gas-supply conduit. The gas manifold is supported by the mount and is coupled to a second end of the gas-supply coupler. The pneumatic cylinders are supported by the mount, with each pneumatic cylinder being arranged to receive a supply of gas via the gas manifold. The grippers are respectively attached to the pneumatic cylinders. Each gripper has an opened state and a closed state brought about by controlled actuation of a corresponding pneumatic cylinder. The mount includes openings, with each of the openings being structured to receive a corresponding shaft for attaching the mount to a gantry assembly of the grinding system.

A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

A damped abrasive cutter having a machine attaching end; an abrasive surface comprising abrasive particles disposed in a binder; a central damping body connecting the machine attaching end to the abrasive surface. The central damping body formed from a synthetic polymer having a Storage Modulus from 1000 MPa to 2500 MPa and a Loss Factor from 0.025 to 0.10.

To provide an installation for cleaning and/or deburring workpieces, comprising a treatment region configured to enable a cleaning treatment and/or a deburring treatment to be performed on a workpiece therein, a loading device for transferring the workpiece from an outer area of the installation into the treatment region and an unloading device for transferring the workpiece from the treatment region into the outer area of the installation, with which installation there is achieved a high workpiece throughput with a favourable cleaning and/or deburring result, it is proposed that the loading device and/or the unloading device comprises at least one treatment device configured to enable the workpiece to be treated during the transfer between the outer area of the installation and the treatment region of the installation.

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units each having first support blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units each having second support blocks (215) for compressing downward upper portions of the compression line springs and thus supporting the compression line springs. The grinding units grind seat surfaces formed on opposite ends of the compression line springs that are moved by the upper and lower chain conveyors. A V-shaped depression (115a) is formed in each first support block so that each of the compression line springs is seated onto the corresponding V-shaped depression. A lower surface (215a) of the second support block that compresses the compression line springs has a planar structure.

A polishing clamp for clamping a work-piece to be polished and a polishing method using the same. The polishing clamp includes a fixing-block for fixing the work-piece to be polished, a recess formed on an end surface of the fixing-block and having the same shape as the work-piece to be polished, the work-piece able to be embedded in the recess, and when the work-piece is placed in the recess, a polished surface of the work-piece to be polished is flush with the end surface of the fixing-block forming the recess. Since a portion of the work-piece to be polished that does not need polish could be prevented from contacting the polishing apparatus by means of the fixing-block when being polished, the over-wearing may not occur at edges and corners of the work-piece, improving the quality of polishing. This can improve the quality of, e.g., a light guide plate.