A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory computer-readable medium and executed by the processor.

A power tool that includes a tool body housing, a drive system, a tool head and a connection system. The drive system is housed in the tool body housing. The tool head, which is configured to perform work on a work piece, includes a tool head housing and an input member that is driven by the drive system when the tool head is coupled to the tool body housing. The tool head can be engaged to the tool body housing in at least two pre-defined and distinct orientations. The connection system secures the tool head to the tool body housing in each of the at least two pre-defined and distinct orientations.

A power tool that includes a tool body housing, a drive system, a tool head and a connection system. The drive system is housed in the tool body housing. The tool head, which is configured to perform work on a work piece, includes a tool head housing and an input member that is driven by the drive system when the tool head is coupled to the tool body housing. The tool head can be engaged to the tool body housing in at least two pre-defined and distinct orientations. The connection system secures the tool head to the tool body housing in each of the at least two pre-defined and distinct orientations.

An integrated equipment for processing a plurality of fiber optic ferrules comprises a polishing system, a ferrule cleaning system, a drying system, a wiping system, and a robot system. The polishing system polishes a plurality of front end faces of the plurality of fiber optic ferrules mounted on a carrier. The ferrule cleaning system cleans the carrier and the fiber optic ferrules on the carrier after the fiber optic ferrules have been polished. The drying system dries the carrier and the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been cleaned. The wiping system wipes the front end faces of the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been dried. The robot system transfers the carrier to the polishing system, the ferrule cleaning system, the drying system, and the wiping system.

An integrated equipment for processing a plurality of fiber optic ferrules comprises a polishing system, a ferrule cleaning system, a drying system, a wiping system, and a robot system. The polishing system polishes a plurality of front end faces of the plurality of fiber optic ferrules mounted on a carrier. The ferrule cleaning system cleans the carrier and the fiber optic ferrules on the carrier after the fiber optic ferrules have been polished. The drying system dries the carrier and the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been cleaned. The wiping system wipes the front end faces of the fiber optic ferrules on the carrier after the carrier and the fiber optic ferrules have been dried. The robot system transfers the carrier to the polishing system, the ferrule cleaning system, the drying system, and the wiping system.

A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.

In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event.

The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.

The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.