A vehicular interior rearview mirror assembly includes a mounting structure, a plastic mirror casing, and a mirror reflective element having a glass substrate. The glass substrate includes a periphery surface extending between a planar first surface and a planar second surface and spanning a thickness dimension of the glass substrate. The mirror casing includes a central mounting portion and spaced apart attachment portions. The mirror reflective element is adhesively attached the spaced apart attachment portions. The central mounting portion includes a first pivot element and the mounting structure includes a second pivot element, the first pivot element and the second pivot element forming a pivot joint. The periphery surface of the glass substrate includes a curved outer surface that provides a rounded transition between the planar first surface of the glass substrate and a less-curved outer surface of a side wall of the mirror casing.

The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

Disclosed are a machining method and a machining device improving machining efficiency and preserving workpiece surface integrity. The machining method improving machining efficiency and preserving workpiece surface integrity includes: setting a workpiece (300) and a machining unit (400); and machining the workpiece (300) by the machining unit (400) at a preset machining speed, wherein the preset machining speed is not lower than a machining speed corresponding to the embrittlement of the workpiece material. By the machining method, the machining speed of the machining unit (400) is set during machining, which results in “skin effect” of subsurface damage caused by the embrittlement of the workpiece material (300) and enables the damage depth of the workpiece (300) to be confined in a shallow subsurface layer, so that the damage depth of the workpiece (300) is reduced, the workpiece integrity is preserved, and the machining quality and the machining efficiency are improved.

An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface.

A method in which an acoustic sensor disposed in a polishing apparatus can be accurately calibrated is disclosed. In this method, polishing sounds of a substrate are acquired using an acoustic sensor; and then at least two distinctive sounds, having distinctive frequencies respectively, are selected from the acquired polishing sounds. Further, the at least two distinctive sounds are output from a sound source coupled to any of a polishing table, the acoustic sensor, and a substrate holder to cause the at least two distinctive sounds to be input to the acoustic sensor. Next, output values of the acoustic sensor are calibrated, such that the output values of the acoustic sensor relative to the at least two distinctive sounds come within an allowable range.

An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on the platen. A process controller is configured to control operation of the apparatus. A set of microphones is disposed inside the process chamber. The set of microphones is arranged to detect sound in the process chamber during operation of the apparatus and transmit an electrical signal corresponding to the detected sound. A signal processor is configured to receive the electrical signal from the set of microphones, process the electrical signal to enable detection of an event during operation of the apparatus, and in response to detecting the event, transmit a feedback signal to the process controller. The process controller is further configured to receive the feedback signal and initiate an action based on the received feedback signal.

The present application relates to systems and methods for obtaining real-time abrasion data. An example computer-implemented method could include receiving, at a computing device, sensor data from one or more sensors. The one or more sensors are disposed in proximity to an abrasive product or a workpiece associated with the abrasive product. The one or more sensors are configured to collect abrasion operational data associated with an abrasive operation involving the abrasive product or the workpiece. The computer-implemented method could further include training, based on the sensor data, a machine learning system to determine product specific information of the abrasive product and/or workpiece specific information. The computer-implemented method could also include providing the trained machine learning system using the computing device.

The present application relates to systems and methods for obtaining real-time abrasion data. An example computer-implemented method could include receiving, at a computing device, sensor data from one or more sensors. The one or more sensors are disposed in proximity to an abrasive product or a workpiece associated with the abrasive product. The one or more sensors are configured to collect abrasion operational data associated with an abrasive operation involving the abrasive product or the workpiece. The computer-implemented method could further include training, based on the sensor data, a machine learning system to determine product specific information of the abrasive product and/or workpiece specific information. The computer-implemented method could also include providing the trained machine learning system using the computing device.

The occurrence of grinding unevenness is prevented even when the movement speed of a robot is changed. Provided is a grinding robot system including: a motor-driven grinder that performs grinding; a robot that grinds a grinding target by means of the grinder in a state in which one of the grinder or the grinding target is attached to a distal end thereof and is moved, and the other is set at a fixed position; and a control unit that controls the robot and the grinder, wherein the control unit calculates a rotational-speed command value for the grinder that changes according to the movement speed of the distal end of the robot and controls the rotational speed of the grinder on the basis of the calculated rotational-speed command value.