A blade sharpening system may include a sharpening tool for sharpening a workpiece. The system may also include a sharpening fixture having a mounting surface for mounting a workpiece to be sharpened by the sharpening tool. The mounting surface may be disposed on a sled that is movable along a sharpening path that passes under a sharpening implement that may be mounted to a movable arm of the sharpening tool when the arm is in an engaged position. The movement of the sled may be coupled to the movement of the arm such that moving the arm from a disengaged position to the engaged position initiates the sled to move in a first direction along the sharpening path and moving the arm from the engaged position to the disengaged position initiates the sled to move along the sharpening path in a second direction.

A blade sharpening system may include a sharpening tool for sharpening a workpiece. The system may also include a sharpening fixture having a mounting surface for mounting a workpiece to be sharpened by the sharpening tool. The mounting surface may be disposed on a sled that is movable along a sharpening path that passes under a sharpening implement that may be mounted to a movable arm of the sharpening tool when the arm is in an engaged position. The movement of the sled may be coupled to the movement of the arm such that moving the arm from a disengaged position to the engaged position initiates the sled to move in a first direction along the sharpening path and moving the arm from the engaged position to the disengaged position initiates the sled to move along the sharpening path in a second direction.

A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.

A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.

A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.

A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.

Method and apparatus for sharpening a cutting tool. In some embodiments, a sharpener has a guide assembly adjacent a moveable abrasive medium. The medium is advanced at a first speed relative to the guide assembly during a coarse sharpening operation in which a user presents the cutting tool against the medium to shape a side of the cutting tool and generate distended material from the cutting edge (e.g., burrs). The medium is subsequently slowed to a lower, second speed for a fine sharpening operation in which the user presents the cutting tool against the medium to remove the distended material and provide a sharpened cutting edge.

Method and apparatus for sharpening a cutting tool. In some embodiments, a sharpener has a guide assembly adjacent a moveable abrasive medium. The medium is advanced at a first speed relative to the guide assembly during a coarse sharpening operation in which a user presents the cutting tool against the medium to shape a side of the cutting tool and generate distended material from the cutting edge (e.g., burrs). The medium is subsequently slowed to a lower, second speed for a fine sharpening operation in which the user presents the cutting tool against the medium to remove the distended material and provide a sharpened cutting edge.

A method of operating a dental polishing apparatus is provided, having a polishing unit driven by a dental machine tool. The polishing unit includes a circular polishing core and a circular polishing assembly particularly surrounding the polishing core. The polishing assembly also has a workpiece to be polished and the polishing assembly deforms elastically when in contact with the workpiece. A numerically controlled steering device moves the polishing assembly along a trajectory on and relative to the workpiece. The workpiece is immersed into the polishing assembly with a constant or substantially constant degree of immersion. The controller adjusts the degree of immersion based on process parameters.

A method of operating a dental polishing apparatus is provided, having a polishing unit driven by a dental machine tool. The polishing unit includes a circular polishing core and a circular polishing assembly particularly surrounding the polishing core. The polishing assembly also has a workpiece to be polished and the polishing assembly deforms elastically when in contact with the workpiece. A numerically controlled steering device moves the polishing assembly along a trajectory on and relative to the workpiece. The workpiece is immersed into the polishing assembly with a constant or substantially constant degree of immersion. The controller adjusts the degree of immersion based on process parameters.