A repaired area on a work surface is presented. The repaired area includes a repairboundary. Within the repairboundary, the work surface has a repair texture and, outside of the repair boundary, the work surface has a work surface texture. The repaired area also includes a repair depth distribution within the repair boundary and a concealing feature. The repaired area is a result of a robotic repair executed on the work surface to remove a defect.

A repaired area on a work surface is presented. The repaired area includes a repairboundary. Within the repairboundary, the work surface has a repair texture and, outside of the repair boundary, the work surface has a work surface texture. The repaired area also includes a repair depth distribution within the repair boundary and a concealing feature. The repaired area is a result of a robotic repair executed on the work surface to remove a defect.

A machine tool includes a workpiece spindle unit (15) including a workpiece spindle (17) and a workpiece spindle motor (20) and includes a tool spindle unit (25) including a tool spindle (27) and a tool spindle motor. The machine tool further includes a first-axis movement mechanism (6) and a second-axis movement mechanism (9) relatively moving, in a plane including an axis of the workpiece spindle (17) and an axis of the tool spindle (27), the workpiece spindle unit (15) and the tool spindle unit (25) in a first axis direction and a second axis direction intersecting the first axis direction, respectively, and further includes a controller. The tool spindle unit (25) is arranged such that the axis of the tool spindle (27) intersects the axis of the workpiece spindle (17). The controller relatively moves the workpiece spindle unit (15) and the tool spindle unit (25) along the axis of the tool spindle (27) through combined operation of the first-axis movement mechanism (6) and second-axis movement mechanism (9), thereby grinding a workpiece (W) with a cup grindstone (T).

A machine tool includes a workpiece spindle unit (15) including a workpiece spindle (17) and a workpiece spindle motor (20) and includes a tool spindle unit (25) including a tool spindle (27) and a tool spindle motor. The machine tool further includes a first-axis movement mechanism (6) and a second-axis movement mechanism (9) relatively moving, in a plane including an axis of the workpiece spindle (17) and an axis of the tool spindle (27), the workpiece spindle unit (15) and the tool spindle unit (25) in a first axis direction and a second axis direction intersecting the first axis direction, respectively, and further includes a controller. The tool spindle unit (25) is arranged such that the axis of the tool spindle (27) intersects the axis of the workpiece spindle (17). The controller relatively moves the workpiece spindle unit (15) and the tool spindle unit (25) along the axis of the tool spindle (27) through combined operation of the first-axis movement mechanism (6) and second-axis movement mechanism (9), thereby grinding a workpiece (W) with a cup grindstone (T).

A dual mounted end-effector system mounted on a motive robot arm for preparing an object surface is described. The system includes a first tool configured to contact and prepare the object surface and a second tool configured to contact and prepare the object surface. The system also includes a force control. The force control is configured to align, in a first state, with the first tool in position to contact and prepare the object surface and, in a second state, with the second tool in a position to contact and prepare the object surface.

A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to detect planarization of topology on the substrate based on a signal from the in-situ acoustic monitoring system.

A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to detect planarization of topology on the substrate based on a signal from the in-situ acoustic monitoring system.

A vehicular frameless interior rearview mirror assembly includes a mirror head and a mounting portion. The mirror head includes a mirror reflective element and a mirror casing. The mirror reflective element includes a glass substrate having a planar front side and a planar rear side. No portion of the mirror casing overlaps the planar front side of the glass substrate of the mirror reflective element. A camera is disposed within the mirror casing. With the mounting portion of the mirror assembly mounted at an in-cabin side of a windshield of a vehicle, the camera views a driver of the vehicle, and when the mirror head is moved by the driver of the vehicle to adjust the rearward view provided by the mirror reflective element to the driver, the camera moves in tandem with movement of the mirror head. The camera is part of a driver monitoring system of the vehicle.

A dual mounted end-effector system mounted on a motive robot arm for preparing an object surface is described. The system includes a first tool configured to contact and prepare the object surface and a second tool configured to contact and prepare the object surface. The system also includes a force control. The force control is configured to align, in a first state, with the first tool in position to contact and prepare the object surface and, in a second state, with the second tool in a position to contact and prepare the object surface.

The present invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, which are improved in terms of both performance and throughput. The substrate cleaning apparatus (16) includes: a cleaning tool (77) configured to clean a substrate (W) held by a substrate holder (71, 72, 73, 74); a surface-property measuring device configured to obtain surface data of the cleaning tool (77); and a controller (30) configured to determine a replacement time of the cleaning tool (77) based on the surface data. The surface-property measuring device is configured to obtain surface data of the cleaning tool (77) at at least two measurement points (PA, PB) of the cleaning tool (77) each time a predetermined number of substrates (W) are scrubbed, and the controller (30) is configured to determine the replacement time of the cleaning tool (77) based on a difference in the surface data obtained.