A method of making a mirror substrate for a vehicular rearview mirror assembly includes providing a glass substrate having a planar front surface, a planar rear surface and a circumferential perimeter edge. The glass substrate is positioned at a fixture and the front perimeter edge portion of the glass substrate is ground by moving a grinding wheel around the periphery of the glass substrate to establish a rounded surface about and around the periphery of the glass substrate and between the planar front surface and a rear portion of the perimeter edge of the glass substrate. The rounded surface has a radius of curvature of at least 2.5 mm. The rounded surface provides a curved transition between the planar front surface of the glass substrate and the rear portion of the perimeter edge of the glass substrate. The planar rear surface of the glass substrate is coated with a coating.

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

An apparatus for automated mold polishing is disclosed. In an embodiment, the apparatus comprises at least a processor and a memory communicatively connected to the processor. The memory containing instructions configuring the at least a processor to receive a finish assignment for at least a surface of a part for manufacture. The processor then determines a polish strategy for the at least a surface as a function of a geometry of the at least a surface. A polishing tool may then be selected for the at least a surface as a function of the finish assignment and the polish strategy for the at least a surface. A reachable area is then determined of the at least a surface as a function of the polishing tool. The processor then generates a toolpath as a function of the reachable area.

An apparatus for automated mold polishing is disclosed. In an embodiment, the apparatus comprises at least a processor and a memory communicatively connected to the processor. The memory containing instructions configuring the at least a processor to receive a finish assignment for at least a surface of a part for manufacture. The processor then determines a polish strategy for the at least a surface as a function of a geometry of the at least a surface. A polishing tool may then be selected for the at least a surface as a function of the finish assignment and the polish strategy for the at least a surface. A reachable area is then determined of the at least a surface as a function of the polishing tool. The processor then generates a toolpath as a function of the reachable area.

A system for sanding a surface includes a sanding tool, a robotic manipulator to move the sanding tool relative to the surface, and a control unit operatively coupled with the sanding tool and the robotic manipulator. The control unit is operable to: (1) move the sanding tool to a sanding position relative to the surface in which an abrasive surface is in contact with the surface and a sanding force is approximately normal to the surface; (2) set one or more sanding parameters corresponding to a model material removal rate; (3) monitor one or more of the sanding parameters; (4) determine an actual material removal rate, based on one or more of the sanding parameters being monitored; and (5) modify one or more of the sanding parameters until the actual material removal rate is approximately equal to the model material removal rate.

A system for sanding a surface includes a sanding tool, a robotic manipulator to move the sanding tool relative to the surface, and a control unit operatively coupled with the sanding tool and the robotic manipulator. The control unit is operable to: (1) move the sanding tool to a sanding position relative to the surface in which an abrasive surface is in contact with the surface and a sanding force is approximately normal to the surface; (2) set one or more sanding parameters corresponding to a model material removal rate; (3) monitor one or more of the sanding parameters; (4) determine an actual material removal rate, based on one or more of the sanding parameters being monitored; and (5) modify one or more of the sanding parameters until the actual material removal rate is approximately equal to the model material removal rate.

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

A processing method of processing a substrate in a processing apparatus includes performing a first grinding processing on the substrate in a first grinder; performing a second grinding processing on the substrate in a second grinder; performing a first re-grinding processing on the substrate in the first grinder; and performing a second re-grinding processing on the substrate in the second grinder. The substrate is ground to a final thickness in the second re-grinding processing.