A processing method of processing a substrate in a processing apparatus includes performing a first grinding processing on the substrate in a first grinder; performing a second grinding processing on the substrate in a second grinder; performing a first re-grinding processing on the substrate in the first grinder; and performing a second re-grinding processing on the substrate in the second grinder. The substrate is ground to a final thickness in the second re-grinding processing.

A silicon wafer single-side polishing method that can significantly improve the stepped minute defect occurrence rate is provided. The silicon wafer single-side polishing method comprises: a first polishing step of performing polishing on one side of a silicon wafer under a first polishing condition; and a second polishing step of performing polishing on the silicon wafer under a second polishing condition in which at least one of an applied pressure and a relative speed in the first polishing condition is changed, after the first polishing step, wherein a polishing rate ratio according to the first polishing condition is higher than a polishing rate ratio according to the second polishing condition.

A silicon wafer single-side polishing method that can significantly improve the stepped minute defect occurrence rate is provided. The silicon wafer single-side polishing method comprises: a first polishing step of performing polishing on one side of a silicon wafer under a first polishing condition; and a second polishing step of performing polishing on the silicon wafer under a second polishing condition in which at least one of an applied pressure and a relative speed in the first polishing condition is changed, after the first polishing step, wherein a polishing rate ratio according to the first polishing condition is higher than a polishing rate ratio according to the second polishing condition.

There is provided a processing method of grinding a workpiece. The processing method includes a holding step of holding the workpiece on a side of its front surface on a chuck table, a coarse grinding step of grinding the workpiece on a side of its back surface with first grinding stones until the workpiece has a predetermined thickness, an auxiliary grinding step of grinding the workpiece on the side of its back surface with the first grinding stones such that an unground region remains at an outer peripheral portion of the workpiece, an unground region grinding step of grinding the unground region with second grinding stones having an average abrasive grain size smaller than that of the first grinding stones, and a finish grinding step of grinding the workpiece on the side of its back surface with the second grinding stones until the workpiece has a predetermined finish thickness.

A grinding apparatus includes a chuck table, a grinding unit, a moving mechanism for moving the chuck table and the grinding unit relatively to each other in predetermined directions, a detector for emitting a web-shaped laser beam and detecting a reflected laser beam thereof, and a control unit. The control unit includes a storing section for storing a relative vertical position of a holding surface to a grinding wheel along the predetermined directions, a first distance calculating section for calculating a first distance in one of the predetermined directions from the detector to a lower surface of the at least one of grindstones, and a lower surface position calculating section for calculating the position of a lower surface of the at least one of grindstones to the holding surface on the basis of the relative vertical position stored in the storing section and the first distance calculated.

A grinding apparatus includes a chuck table, a grinding unit, a moving mechanism for moving the chuck table and the grinding unit relatively to each other in predetermined directions, a detector for emitting a web-shaped laser beam and detecting a reflected laser beam thereof, and a control unit. The control unit includes a storing section for storing a relative vertical position of a holding surface to a grinding wheel along the predetermined directions, a first distance calculating section for calculating a first distance in one of the predetermined directions from the detector to a lower surface of the at least one of grindstones, and a lower surface position calculating section for calculating the position of a lower surface of the at least one of grindstones to the holding surface on the basis of the relative vertical position stored in the storing section and the first distance calculated.

In an automatic polishing system configured such that under control of a polishing robot and/or a polishing tool by a polishing controller, the polishing tool provides a polishing action on a polishing subject face, a color intensity measurement instrument is provided for measuring an intensity of a specified color in the polishing subject face. Based on the intensity of the specified color measured by this color intensity measurement instrument, the polishing controller controls the polishing robot and/or the polishing tool, so that an amount of polishing work by the polishing tool onto the polishing subject face is adjusted according to the intensity of the specified color.

In an automatic polishing system configured such that under control of a polishing robot and/or a polishing tool by a polishing controller, the polishing tool provides a polishing action on a polishing subject face, a color intensity measurement instrument is provided for measuring an intensity of a specified color in the polishing subject face. Based on the intensity of the specified color measured by this color intensity measurement instrument, the polishing controller controls the polishing robot and/or the polishing tool, so that an amount of polishing work by the polishing tool onto the polishing subject face is adjusted according to the intensity of the specified color.

A method for conducting an abrasive operation can include providing a fixed abrasive article and separating a first part from a second part using the fixed abrasive article according to a deterministic process.

A method for conducting an abrasive operation can include providing a fixed abrasive article and separating a first part from a second part using the fixed abrasive article according to a deterministic process.