The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.

A method of monitoring a chemical mechanical polishing (CMP) apparatus including an arm configured to swing a polishing component includes performing a CMP process; learning at least two positions of the polishing component during a normal swing motion of the polish component by an optical acceptor and a processing unit to determine a plurality of expected positions of the polish component; analyzing at least one real position of the polishing component at predetermined time points during the CMP process by the optical acceptor and the processing unit; inspecting whether an abnormal event occurs based on the analyzed real position of the polishing component and the expected positions by the processing unit during the CMP process; and determining whether to send an alarm and stop the CMP process based on the inspecting result.

Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom. In one embodiment, a polishing system includes a substrate carrier comprising an annular retaining ring which is used to surround a to-be-processed substrate during a polishing process and a polishing platen. The polishing platen includes cylindrical metal body having a pad-mounting surface. The pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone. A surface of the second zone is recessed from surfaces of the first and third zones adjacent thereto, and a width of the second zone is less than an outer diameter of the annular retaining ring.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a compressed gas stream, a mixer coupled to the source and the compressor to mix the dry ice particles with the compressed gas stream to form a stream of compressed gas with entrained dry ice particles, and a nozzle coupled to the mixer to direct the stream of compressed gas with entrained dry ice particles onto a polishing surface of the polishing pad at sufficient velocity to condition the polishing pad.

There is provided a cutting apparatus that cuts a workpiece by a cutting blade. The cutting apparatus includes a chuck table that holds a board in which a groove is formed through cutting of the board by the cutting blade, a cutting unit having a spindle and a mount flange that is fixed to a tip part of the spindle and on which the cutting blade is mounted, and a replacement apparatus that replaces the cutting blade mounted on the mount flange with the cutting blade stored in a blade storing part and replaces the board placed on the chuck table with the board stored in a board storing part. The replacement apparatus includes a holding part that holds the cutting blade and the board under suction.

A method dresses one polishing cloth or two polishing pads simultaneously, in which a polishing cloth has been applied to a polishing plate, with at least one dresser (4), which is equipped with at least one dressing element (8), this at least one dressing element (8) being in contact with the at least one polishing cloth (11, 12) to be dressed, wherein the at least one polishing plate (21, 22) is rotated with a relative rotational speed and the at least one dresser (4) is rotated with a relative rotational speed and at least two different combinations of directions of rotation of the two pairs of polishing plates (21, 22) and pin wheels (31, 32) are executed during the simultaneous dressing of two polishing pads (11, 12) or during the dressing of one polishing cloth (11) of the polishing plate (21) and of the at least one dresser (4).

An online precise control method for truncating parameters of microscale abrasive grains includes the steps of: (1) clamping an electrode and a diamond grinding wheel to form a discharge circuit, and communicating a workstation with a power supply and a controller of a numerical control machine tool; (2) feedback controlling movement parameters of the machine tool and parameters of the power supply according to pulse discharge parameters, controlling a discharge current and a discharge voltage, and calculating a number of rotations of the grinding wheel; (3) determining a maximum truncating area of a cutting edge and a maximum effective number of rotations of the grinding wheel according to grinding wheel parameters and pulse discharge parameters, and precisely controlling a truncating area of a cutting edge of abrasive grains online by the calculated number of rotations of the grinding wheel; and (4) after the calculated number of rotations of the grinding wheel reaches a target value, calculating a truncating area of the cutting edge and a protrusion height of truncating microscale abrasive grains, and stopping the machine tool.

An in-situ spark erosion dressing system includes a working platform, a moving platform, a cutting device, a spark erosion dressing device and a controller. The moving platform is coupled to the working platform and configured to load a work piece. The cutting device is coupled to the working platform and has a first cutting position and a first dressing position. The cutting device includes a wheel blade and the wheel blade cuts the work piece on the first cutting position. The spark erosion dressing device is coupled to the moving platform and includes a dressing electrode. The dressing electrode contacts the wheel blade on the first dressing position, and the spark erosion dressing device applies the discharge energy on the dressing electrode to dress the wheel blade. The controller controls the cutting device to move to the first cutting position according to a cutting resistance value.

The invention relates to a machine tool, hi particular a lathe grinding machine, comprising a tool spindle, a spindle motor and a tool clamped in a covet, with which tool a workpiece may be machined which may be moved in several axes relative to the tool, and comprising a control device for the tool spindle which controls the spindle motor. A spindle load detection device (24) which is connected with the control device (20) is provided and the control device (20) compares the output signal (26) of the spindle load detection device (24) with a predetermined threshold value (50), said threshold value (50) being below, in particular at least 20% below, the breaking load (54) of the tool (18). The control device (20) turns off the spindle motor (14) when the output signal (26) of the spindle load detection device (24) exceeds the threshold value (50).