To provide a light-emitting element having high luminous efficiency and to provide a light-emitting device and an electronic device which consumes low power and is driven at low voltage, a carbazole derivative represented by the general formula (1) is provided. In the formula, α.sup.1, α.sup.2, α.sup.3, and α.sup.4 each represent an arylene group having less than or equal to 13 carbon atoms; Ar.sup.1 and Ar.sup.2 each represent an aryl group having less than or equal to 13 carbon atoms; R.sup.1 represents any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group, and a substituted or unsubstituted biphenyl group; and R.sup.2 represents any of an alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group, and a substituted or unsubstituted biphenyl group. In addition, l, m, and n are each independently 0 or 1.

An improved switching material for forming a composite article over a substrate is disclosed. A first volume of nanotubes is combined with a second volume of nanoscopic particles in a predefined ration relative to the first volume of nanotubes to form a mixture. This mixture can then be deposited over a substrate as a relatively thick composite article via a spin coating process. The composite article may possess improved switching properties over that of a nanotube-only switching article. A method for forming substantially uniform nanoscopic particles of carbon, which contains one or more allotropes of carbon, is also disclosed.

The present invention relates to a compound of the formula (I), (II) or (III), to the use of the compound in an electronic device, and to an electronic device comprising a compound of the formula (I), (II) or (III). The present invention furthermore relates to a process for the preparation of a compound of the formula (I), (II) or (III) and to a formulation comprising one or more compounds of the formula (I), (II) or (III).

Methods for forming an OLED device are described. An encapsulation structure having organic buffer layer sandwiched between barrier layers is deposited over an OLED structure. The buffer layer is formed with a fluorine-containing plasma. The second barrier layer is then deposited over the buffer layer. Additionally, to ensure good adhesion, a buffer adhesion layer is formed between the buffer layer and the first barrier layer. Finally, to ensure good transmittance, a stress reduction layer is deposited between the buffer layer and the second barrier layer.

A display device includes a first substrate including an active area, a bending area, and a pad area; a plurality of pixels to display an image in the active area, each of the plurality of pixels including an organic light emitting diode (OLED); a signal line and a power line disposed on the first substrate, the signal line and the power ling being disposed on a same layer in the bending area, the bending area on the first substrate being configured to be bent flexibly; and a second substrate facing the active area and disposed on the first substrate.

An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate.

Polymers comprising at least one unit of formula (1) and their use as semiconducting materials.

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The present invention relates to formulations comprising at least one organic semiconductor and at least one organic solvent, characterized in that the formulation contains less than 10,000 particles per liter formulation having an average size in the range from 0.1 to 20 μm, to their use for the preparation of electronic devices, to methods for preparing electronic devices using the formulations of the present invention, and to electronic devices prepared from such methods and formulations.

The present disclosure provides a packaging adhesive, a packaging method, a display panel, and a display device. The packaging adhesive includes a frit, an organic solvent, and a material with a thermal expansion coefficient larger than that of the frit. Using the packaging adhesive provided by the present disclosure, the thermal expansion coefficient of the packaging adhesive from which the organic solvent is removed may be enhanced by doping the material with a thermal expansion coefficient larger than that of the frit into existing glass cement, so that in a packaging process using laser radiation, an expansion volume of the packaging adhesive when heated is increased. In this way, a gap between the packaging adhesive and an array substrate is effectively reduced, and a packaging effect is improved.

The present disclosure provides a display substrate, comprising: a bending resistant region; the region comprises a base and a metal wire layer, wherein the metal wire layer is directly formed on the base, or the region further comprises an organic buffer layer located between the base and the metal wire layer, and the metal wire layer is directly formed on the organic buffer layer. The present disclosure provides a method for manufacturing the display substrate above-described. The present disclosure further provides a display device, comprising the display substrate above-described. The present disclosure further provides a method for manufacturing the display device, comprising the method for manufacturing the display substrate above-described. The present disclosure forms a bending resistant structure in a predetermined bending resistant region on the bezel portions of the display substrate, which can enhance the bend resistance thereof and improve the quality of the flexible display.