Diamond bodies and methods of manufacture are disclosed. Diamond bodies are formed from at least a bimodal, alternatively a tri-modal or higher modal, feedstock having at least one fraction of modified diamond particles with a fine particle size (0.5-3.0 μm) and at least one fraction of diamond particles with coarse particle size (15.0 to 30 μm). During high pressure-high temperature processing, fine particle sized, modified diamond particles in the first fraction preferentially fracture to smaller sizes while preserving the morphology of coarse particle sized diamond particles in the second fraction. Diamond bodies incorporating the two fractions have a microstructure including second fraction diamond particles dispersed in a continuous matrix of first fraction modified diamond particles and exhibit improved wear characteristics, particularly for wear associated with drilling of geological formations.

A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.

Provided is a method for producing a polycrystalline diamond body, the method including a first step of heat-treating a powder of high-pressure-phase carbon at higher than or equal to 1300° C. to obtain a heat-treated carbon powder, and a second step of sintering the heat-treated carbon powder under conditions of greater than or equal to 12 GPa and less than or equal to 25 GPa and higher than or equal to 1200° C. and lower than or equal to 2300° C. to obtain a polycrystalline diamond body.

Provided is a method for producing a polycrystalline diamond body, the method including a first step of heat-treating a powder of high-pressure-phase carbon at higher than or equal to 1300° C. to obtain a heat-treated carbon powder, and a second step of sintering the heat-treated carbon powder under conditions of greater than or equal to 12 GPa and less than or equal to 25 GPa and higher than or equal to 1200° C. and lower than or equal to 2300° C. to obtain a polycrystalline diamond body.

A method of aligning abrasive particles on a substrate. The method comprises providing a substrate. The method also comprises providing abrasive particles. The method also comprises generating a modulated electrostatic field. The modulated electrostatic field is configured to have a first effective direction at a first time and a second effective direction at a second time. The electrostatic field is configured to cause the abrasive particles to align rotationally in both a z-direction and a y-direction.

A method of aligning abrasive particles on a substrate. The method comprises providing a substrate. The method also comprises providing abrasive particles. The method also comprises generating a modulated electrostatic field. The modulated electrostatic field is configured to have a first effective direction at a first time and a second effective direction at a second time. The electrostatic field is configured to cause the abrasive particles to align rotationally in both a z-direction and a y-direction.

A tool for polishing glass is formed by integrating multiple polishing elements in which polishing grains have been covered with a resin, and includes air cavities. The polishing grain volume S ratio is 50-85%, the resin volume ratio is 15-50%, the air cavity volume ratio is 20% or less, and the average grain size of the polishing elements is 10 μm or less.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.