B24D3/00

Abrasive buffing articles

The present disclosure relates to abrasive buffing articles (“abrasive buffs”) and methods of making the same. The abrasive buffs include a substrate, such as a fabric, that has been impregnated with an abrasive polymeric composition that includes abrasive particles, such as primary abrasive particles and/or abrasive aggregates, such as spray dried abrasive aggregates. The abrasive buffs are flexible and capable of conforming to and effectively abrading, polishing, and buffing workpieces possessing a complex geometry.

SYNTHETIC GRINDSTONE
20220088746 · 2022-03-24 · ·

A synthetic grindstone (100) for chemo-mechanical grinding a wafer S, comprising: an abrasive (101) that contains cerium oxide having an average particle diameter of 10 μm or less as a main component and has a chemo-mechanical grinding action on the wafer S; a friction promoter (102) that contains a fiber material having a Mohs hardness lower than that of the wafer S and a high friction coefficient as a main component and promotes heat generation; and a binder (103) that contains a phenol resin as a main component and disperses and binds the abrasive (101) and the friction promotor (102).

SYSTEM AND METHOD FOR CLEANING CONTACT ELEMENTS AND SUPPORT HARDWARE USING FUNCTIONALIZED SURFACE MICROFEATURES

A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.

SYSTEM AND METHOD FOR CLEANING CONTACT ELEMENTS AND SUPPORT HARDWARE USING FUNCTIONALIZED SURFACE MICROFEATURES

A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.

POLISHING PAD CONDITIONER AND MANUFACTURING METHOD THEREOF

The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.

Dense packing particle size distribution for PDC cutters
11279002 · 2022-03-22 · ·

A superabrasive compact and a method of making the superabrasive compact are disclosed. A method of making a superabrasive compact comprises steps of providing a plurality of superabrasive particles having a particle size distribution with a first ratio (d50)/(d50 principle particles) ranging from about 0.86 to about 0.92; providing a support to the plurality of superabrasive particles; and subjecting the support and the plurality of superabrasive particles to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact.

Dense packing particle size distribution for PDC cutters
11279002 · 2022-03-22 · ·

A superabrasive compact and a method of making the superabrasive compact are disclosed. A method of making a superabrasive compact comprises steps of providing a plurality of superabrasive particles having a particle size distribution with a first ratio (d50)/(d50 principle particles) ranging from about 0.86 to about 0.92; providing a support to the plurality of superabrasive particles; and subjecting the support and the plurality of superabrasive particles to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact.

SERRATED SHAPED ABRASIVE PARTICLES AND METHOD FOR MANUFACTURING THEREOF

The present disclosure provides a shaped abrasive particle. The shaped abrasive particle includes a plurality of polygonal faces bound by respective polygonal perimeters and joined by at least one edge or sidewall to form the shaped abrasive particle. The shaped abrasive particle further includes a serration configured to generate a fracture along a fracture plane extending at least through the serration.

METHOD FOR DEPOSITING ABRASIVE PARTICLES

The disclosure relates to, among other things, a method of making a coated abrasive article, the method comprising sequentially: locating a plurality of shaped abrasive particles in a tool comprising a plurality of cavities, wherein the plurality of shaped abrasive particles is held in the plurality of cavities, at least in part, electrostatically; and disposing the plurality of shaped abrasive particles onto a make layer precursor of a backing having first and second opposed major surfaces, wherein the make layer precursor is disposed on at least a portion of the first major surface.

DEVICES FOR CLEANING SUBSTRATES AND RELATED METHODS

A device for cleaning substrates. The device comprises a polymeric pad, a frame body, and a coupling member. The polymeric pad has a top surface and a bottom surface. At least a portion of the frame body extends between the top surface and the bottom surface of the polymeric paid. A coupling member extends upwards from at least a portion of the frame body.