The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.

An abrasive article including a body including abrasive particles contained within a bond material, a first major surface, a second major surface, and a side surface extending between the first major surface and second major surface, and a coating overlying at least a portion of one of the first major surface or the second major surface. In an embodiment, the coating comprises at least one element selected from the group of chromium, nickel, carbon, nitrogen, tungsten, sulfur, molybdenum, iron, zinc, silicon, titanium, aluminum, zirconium, magnesium, zinc, boron, cobalt, calcium, or any combination thereof. In another embodiment, the coating comprises a cermet, a ceramic, or a combination thereof.

The polishing pad is for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed from a prepolymer reaction of H.sub.12MDI/TDI with polytetramethylene ether glycol to form an isocyanate-terminated reaction product. The isocyanate-terminated reaction product has 8.95 to 9.25 weight percent unreacted NCO and has an NH.sub.2 to NCO stoichiometric ratio of 102 to 109 percent. The isocyanate-terminated reaction product is cured with a 4,4′-methylenebis(2-chlororaniline) curative agent. The cast polyurethane polymeric material, as measured in a non-porous state, having a shear storage modulus, G′ of 250 to 350 MPa as measured with a torsion fixture at 30° C. and 40° C. and a shear loss modulus, G″ of 25 to 30 MPa as measured with a torsion fixture at 40° C. The polishing pad having a porosity of 20 to 50 percent by volume and a density of 0.60 to 0.95 g/cm.sup.3.

Embodiments relate to a polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table bonded to a cemented carbide substrate including tungsten carbide grains having a fine average grain size to provide one or more of enhanced wear resistance, corrosion resistance, or erosion resistance, and a PDC with enhanced impact resistance. In an embodiment, a PDC includes a cemented carbide substrate having a cobalt-containing cementing constituent cementing tungsten carbide grains together exhibiting an average grain size of about 1.5 μm or less. The substrate includes an interfacial surface and a depletion zone depleted of the cementing constituent that extends inwardly from the interfacial surface to a depth of, for example, about 30 μm to about 60 μm. The PDC includes a PCD table bonded to the interfacial surface of the substrate. The PCD table includes diamond grains bonded together exhibiting an average grain size of about 40 μm or less.

The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

The present invention provides a cerium oxide based composite polishing powder and a preparation method thereof. The polishing powder contains the element magnesium in an amount of 0.005 wt %-5 wt % to magnesium oxide meter. The preparation method includes: (1) uniformly mixing a salt solution containing cerium serving as the main component of the polishing powder; (2) uniformly mixing a precipitating agent of an aqueous magnesium bicarbonate solution with the mixed solution prepared in step (1) to obtain a slurry; (3) aging the slurry prepared in step (2) for 0-48 h while the temperature of the slurry is kept at 30-90 degrees centigrade, and filtering the aged slurry to obtain the precursor powder of the polishing powder; (4) calcinating the precursor powder at 600-1000 degrees centigrade, then dispersing and separating the calcinated precursor powder to obtain the polishing powder. The present invention improves the polishing performance and the suspension performance of polishing powder.

The present invention relates to a nano-diamond dispersion solution and a method of preparing the same. The method of preparing a nano-diamond dispersion solution comprises the following steps: providing a nano-diamond aggregation; mixing the nano-diamond aggregation with a metal hydroxide solution and stirring the mixture such that the nano-diamond aggregation is separated, to obtain a mixture solution; stabilizing the mixture solution such that the mixture solution is separated into a supernatant and precipitates; and extracting the supernatant and precipitates.

An abrasive grain includes a surface having at least a first face with a first outline, and at least one second face with a second outline. The first outline does not contain any vertices, but the second outline contains at least one vertex. The abrasive grain may include a ceramic material, especially polycrystalline α-Al.sub.2O.sub.3.

Shaped ceramic abrasive particles include a first surface having a perimeter having a perimeter comprising at least first and second edges. A first region of the perimeter includes the second edge and extends inwardly and terminates at two corners defining first and second acute interior angles. The perimeter has at most four corners that define acute interior angles. A second surface is disposed opposite, and not contacting, the first surface. A peripheral surface is disposed between and connects the first and second surfaces. The peripheral surface has a first predetermined shape. Methods of making the shaped ceramic abrasive particles, and abrasive articles including them are also disclosed.

Shaped ceramic abrasive particles include a first surface having a perimeter having a perimeter comprising at least first and second edges. A first region of the perimeter includes the second edge and extends inwardly and terminates at two corners defining first and second acute interior angles. The perimeter has at most four corners that define acute interior angles. A second surface is disposed opposite, and not contacting, the first surface. A peripheral surface is disposed between and connects the first and second surfaces. The peripheral surface has a first predetermined shape. Methods of making the shaped ceramic abrasive particles, and abrasive articles including them are also disclosed.