Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.

The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.

A coated abrasive disc includes a disc backing having an outer circumference. An abrasive layer is disposed on the disc backing. The abrasive layer comprises triangular abrasive platelets secured to a major surface of the disc backing by at least one binder material. The triangular abrasive platelets are disposed at least 70 percent of regularly-spaced points along an arithmetic spiral pattern extending outwardly toward the outer circumference. Each one of the triangular abrasive platelets has respective top and bottom surfaces connected to each other, and separated by, three sidewalls. On a respective basis, one sidewall of at least 90 percent of each of the triangular abrasive platelets disposed facing and proximate to the disc backing, and is lengthwise aligned within 10 degrees of being tangent to the arithmetic spiral pattern. Methods of making and using the coated abrasive disc are also disclosed.

A coated abrasive disc includes a disc backing and an abrasive layer disposed thereon. The abrasive layer comprises abrasive elements secured to a major surface of the disc backing by at least one binder material. The abrasive elements are disposed at contiguous intersections of horizontal and vertical lines of a rectangular grid pattern. At least 70 percent of the intersections have one of the abrasive elements disposed thereat. Each of the abrasive elements has two triangular abrasive platelets. Each one of the triangular abrasive platelets has respective top and bottom surfaces connected to each other, and separated by, three sidewalls. On a respective basis, one sidewall of at least 90 percent of the triangular abrasive platelets is disposed facing and proximate to the disc backing. The abrasive elements are arranged such that the triangular abrasive platelets in orthogonally adjacent abrasive elements have a Z-axis rotational orientation within 10 degrees of perpendicular to each other. Methods of making and using the coated abrasive disc are also disclosed.

A coated abrasive disc includes a disc backing and an abrasive layer disposed thereon. The abrasive layer comprises abrasive elements secured to a major surface of the disc backing by at least one binder material. The abrasive elements are disposed at contiguous intersections of horizontal and vertical lines of a rectangular grid pattern. Each abrasive element has two triangular abrasive platelets, each having respective top and bottom surfaces connected to each other, and separated by, three sidewalls. On a respective basis, one sidewall of the triangular abrasive platelets is disposed facing and proximate to the disc backing. A first portion of the abrasive elements is arranged in alternating first rows wherein the triangular abrasive platelets are disposed lengthwise aligned with the vertical lines. A second portion of the abrasive elements is arranged in alternating second rows wherein the triangular abrasive platelets are disposed lengthwise aligned with the horizontal lines. The first and second rows repeatedly alternate along the vertical lines. Methods of making and using the coated abrasive disc are also disclosed.

A coated abrasive disc includes a disc backing and an abrasive layer disposed thereon. The abrasive layer comprises abrasive elements secured to a major surface of the disc backing by at least one binder material. The abrasive elements are disposed at contiguous intersections of horizontal and vertical lines of a rectangular grid pattern. Each abrasive element has two triangular abrasive platelets, each having respective top and bottom surfaces connected to each other, and separated by, three sidewalls. On a respective basis, one sidewall of the triangular abrasive platelets is disposed facing and proximate to the disc backing. A first portion of the abrasive elements is arranged in alternating first rows wherein the triangular abrasive platelets are disposed lengthwise aligned with the vertical lines. A second portion of the abrasive elements is arranged in alternating second rows wherein the triangular abrasive platelets are disposed lengthwise aligned with the horizontal lines. The first and second rows repeatedly alternate along the vertical lines. Methods of making and using the coated abrasive disc are also disclosed.

Nonwoven abrasive articles comprise a nonwoven abrasive member having an overlayer composition comprising a fatty acid metal salt disposed thereon adjacent to a working surface. The nonwoven abrasive member comprises abrasive particles adhered to a fiber web by a binder. The abrasive particles may be exposed and/or the nonwoven abrasive member may have suitable frictional properties. Methods of making the same are also disclosed.

The present invention provides a polishing pad whose crosslinking density is adjusted to enhance the performance of the CMP process such as polishing rate and cut pad rate, in addition, in the process for preparing a polishing pad according to the embodiment, it is possible to implement such a crosslinking density by a simple method of controlling the preheating temperature of the mold for curing, Thus, the polishing pad may be applied to a process of preparing a semiconductor device, which comprises a CMP process, to provide a semiconductor device such as a wafer of excellent quality.

Method for manufacturing a non-woven abrasive article, and non-woven fibers are made of a certain starting material and are subjected to method steps of forming a non-woven web, then consolidating the non-woven web. In order to improve the homogeneity, as well as the reproducibility of the non-woven abrasive article manufactured, the non-woven fibers, prior to the method step of forming a non-woven web and/or prior to the method step of consolidating the non-woven web, are coated with abrasive grains in such a way that the abrasive grains adhere to the certain starting material.