Abrasive articles, along with related compositions and methods, are provided. The abrasive articles include a backing, abrasive layer, and supersize coat that includes calcium stearate and an ammonium salt of a modified styrene acrylic polymer. The supersize coat can be dried to a translucent film at temperatures well below the melting temperature of the binder without need for a surfactant. Advantageously, these abrasive articles can reduce swarf accumulation during an abrading operation and enhance cut performance while achieving a high degree of optical clarity.

A phenolic resin composition is described comprising at least 50 wt.-% of phenolic resin; first polymerized units comprising a cationic group; and second polymerized units comprising an anionic group. The cationic groups are ionically bonded to the anionic groups. The ionic bonding of the cationic group and anionic group of the polymerized units can provide certain complex viscosity and/or tan delta properties. In some embodiments, the phenolic resin composition has a complex viscosity at 65C of at least 50 Pascal(seconds) and/or has a tan delta at 65C ranging from 0.5 to 2.5. Abrasive articles and methods of making an abrasive article are also described.

A phenolic resin composition is described comprising at least 50 wt.-% of phenolic resin; first polymerized units comprising a cationic group; and second polymerized units comprising an anionic group. The cationic groups are ionically bonded to the anionic groups. The ionic bonding of the cationic group and anionic group of the polymerized units can provide certain complex viscosity and/or tan delta properties. In some embodiments, the phenolic resin composition has a complex viscosity at 65C of at least 50 Pascal(seconds) and/or has a tan delta at 65C ranging from 0.5 to 2.5. Abrasive articles and methods of making an abrasive article are also described.

The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

An abrasive article includes a body and an electronic assembly coupled to the body, the electronic assembly including an electronic device, and a first portion between the body and the communication device, the first portion having a material of an average relative magnetic permeability of not greater than 15.

A shaped abrasive particle including a body having a first major surface, a second major surface, and a side surface joined to the first major surface and the second major surface, and the body has at least one partial cut extending from the side surface into the interior of the body.

A shaped abrasive particle including a body having a first major surface, a second major surface, and a side surface joined to the first major surface and the second major surface, and the body has at least one partial cut extending from the side surface into the interior of the body.

The present invention relates to a polishing pad that minimizes the occurrence of defects and a process for preparing the same, Since the polishing pad comprises fine hollow particles having shells, the glass transition temperature (Tg) of which is adjusted, the hardness of the shells and the shape of micropores on the surface of a polishing layer are controlled. Since the content of Si in the polishing layer is adjusted, it is possible to prevent the surface damage of a semiconductor substrate caused by hard additives. As a result, the polishing pad can provide a high polishing rate while minimizing the occurrence of defects such as scratches on the surface of a semiconductor substrate during the CMP process.

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or micro-features and/or a plurality of grooves or macro-features formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.