An abrasive flap disc having improved properties with respect to production and grinding behavior combines an abrasive grit having a special grit mixture having 25% to 75% (high-performance ceramic) zirconium dioxide and of 25% to 75% aluminum oxide and a number of abrasive lamellae per abrasive flap disc in the range between 30 and 46.

An abrasive article, in particular a coated abrasive disc, includes a plurality of holes which are arranged in a hole pattern. The density of holes decreases from an inner region of the hole pattern to an outer region of the hole pattern. At least one hole in the hole pattern is designed as an elongated hole.

An abrasive article, in particular a coated abrasive disc, includes a plurality of holes which are arranged in a hole pattern. The density of holes decreases from an inner region of the hole pattern to an outer region of the hole pattern. At least one hole in the hole pattern is designed as an elongated hole.

The present invention is a cleaning article including a substrate, a base coating on at least a surface of the substrate, and a surface coating disposed on the base coating. The surface coating includes water, a binder, a cross-linker, a thickener, and decorative particles. The decorative particles constitute between about 30 to about 300 grams per square meter wet basis weight of the cleaning article. At least about 50% of the decorative particles remains on the cleaning article after use.

The present invention is a cleaning article including a substrate, a base coating on at least a surface of the substrate, and a surface coating disposed on the base coating. The surface coating includes water, a binder, a cross-linker, a thickener, and decorative particles. The decorative particles constitute between about 30 to about 300 grams per square meter wet basis weight of the cleaning article. At least about 50% of the decorative particles remains on the cleaning article after use.

A coated abrasive article maker apparatus is disclosed comprising a first web path comprising a production tool and a second web path configured for a resin coated backing. The second web path is configured to guide the resin coated backing through the coated abrasive article maker apparatus with the resin layer positioned facing the dispensing surface. An abrasive particle feeder is positioned along the first web path and is configured to dispense abrasive particles onto the dispensing surface such that abrasive particles are removably disposed within cavities of the production tool. Abrasive particles are transferred from the plurality of cavities to the resin layer of the resin coated backing when the production tool is positioned adjacent the resin coated backing.

A polyurethane foam backing suitable for making a coated abrasive article is disclosed. The polyurethane foam backing has a textured surface bearing an array of raised features and land areas. The array's geometry is designed such that a 90 degree peel force to remove a production tooling having a contacting surface bearing a plurality of microreplicated mold cavities from the textured surface is accept able.

The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

A wafer cleaning and polishing pad includes a pad having a polishing surface, wherein the polishing surface includes a first material having a Shore D hardness ranging from 50 to 80 and a static coefficient of friction ranging from 0.01 to 0.6. The first material is a fluoropolymer. The pad includes a middle layer and/or a base under the polishing surface. The base includes a second material and the middle layer includes a third material having a lower surface hardness and a higher coefficient of friction than the first material. The polishing surface includes a plurality of grooves with varying groove depth from center of the pad to an edge of the pad.

A wafer cleaning and polishing pad includes a pad having a polishing surface, wherein the polishing surface includes a first material having a Shore D hardness ranging from 50 to 80 and a static coefficient of friction ranging from 0.01 to 0.6. The first material is a fluoropolymer. The pad includes a middle layer and/or a base under the polishing surface. The base includes a second material and the middle layer includes a third material having a lower surface hardness and a higher coefficient of friction than the first material. The polishing surface includes a plurality of grooves with varying groove depth from center of the pad to an edge of the pad.