A method and systems for controlling optical transmissivity of a polish pad material are provided. The method and systems may include adjusting control parameters to determine the optical transmissivity of a polish pad material. The control parameters may also include pre-processing controls, casting controls, and/or curing controls. Methods and systems also provided for assembling a polish pad that controls the optical transmissivity of the polish pad. Additionally, a polish pad with a controlled optical transmissivity is provided.

An abrasive disc for use with a sanding tool having a plurality of dust collection holes includes a hole pattern consisting of six openings arranged for substantial alignment with the dust collection holes provided in the sanding tool.

An abrasive disc for use with a sanding tool having a plurality of dust collection holes includes a hole pattern consisting of six openings arranged for substantial alignment with the dust collection holes provided in the sanding tool.

A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.

The invention relates to obtaining an abrasive product comprising a backing layer and an abrasive layer, wherein the backing layer comprises propylene homopolymer or copolymer.

The invention relates to obtaining an abrasive product comprising a backing layer and an abrasive layer, wherein the backing layer comprises propylene homopolymer or copolymer.

A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.

A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.