B24D11/00

Nonwoven abrasive article with extended life

Abrasive articles including a non-woven web of staple fibers that form a single layer that is free of any additional layers of non-woven webs of staple fibers. The abrasive articles contain abrasive particles bound to the non-woven web. The abrasive articles can be compressed abrasive articles that include a non-woven web of staple fibers, including blends of staple fibers having a first portion of fibers having a first linear density and a second portion of fibers having a second linear density.

Method and systems to control optical transmissivity of a polish pad material

A method and systems for controlling optical transmissivity of a polish pad material are provided. The method and systems may include adjusting control parameters to determine the optical transmissivity of a polish pad material. The control parameters may also include pre-processing controls, casting controls, and/or curing controls. Methods and systems also provided for assembling a polish pad that controls the optical transmissivity of the polish pad. Additionally, a polish pad with a controlled optical transmissivity is provided.

Polycrystalline diamond compact including crack-resistant polycrystalline diamond table
10022840 · 2018-07-17 · ·

Embodiments relate to polycrystalline diamond compacts (PDCs) including a substrate and a polycrystalline diamond (PCD) table mounted to the substrate. The PCD table includes an upper surface and one or more recesses extending inwardly from the upper surface of the PCD table. The one or more recesses may help prevent, stop, or limit crack propagation and may redistribute, breakup, or relieve stresses in the PCD table. In some embodiments, the one or more recesses exhibit, in plain view, a generally rectangular geometry, a generally circular geometry, or a generally triangular geometry. In some embodiments, the PCD table includes one or more channels that extend from a vertex of the one or more recesses. In some embodiments, the one or more channels and the one or more recesses may be at least partially filled with a sacrificial material. Methods for forming such PDCs are also discussed.

Abrasive film fabrication method and abrasive film

A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

Abrasive film fabrication method and abrasive film

A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts

Methods of forming polycrystalline compacts include subjecting a plurality of grains of hard material interspersed with a catalyst material to high-temperature and high-pressure conditions to form a polycrystalline material having intergranular bonds and interstitial spaces between adjacent grains of the hard material. The catalyst material is disposed in at least some of the interstitial spaces in the polycrystalline material. The methods further comprise substantially removing the catalyst material from the interstitial spaces in at least a portion of the polycrystalline material to form an at least partially leached polycrystalline compact; and removing a portion of the polycrystalline material from which the catalyst material has been substantially removed from the at least partially leached polycrystalline compact. The polycrystalline cutting elements may be secured to a bit body of an earth-boring tool.

GRINDING MATERIAL AND PRODUCTION METHOD OF GRINDING MATERIAL

The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80 and no greater than 98.

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
10011046 · 2018-07-03 · ·

The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm.sup.2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
10011046 · 2018-07-03 · ·

The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm.sup.2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.

ABRASIVE BODY
20180177529 · 2018-06-28 ·

The invention relates to an abrasive body (6) for a grinding tool with an abrasive layer (8), which has at least one binding agent (12) and abrasive grains (13), characterised in that thermochromic colouring agents are provided in the abrasive layer (8).

The invention relates further to a grinding tool (1) with an abrasive body (6) according to the invention and elements (5) for connecting the grinding tool (1) to a driving device for rotatingly driving the abrasive body (6).

The invention relates further to a use of the abrasive body (6) according to the invention or of the grinding tool (1) according to the invention for treating human body parts.