The present disclosure provides improved rail grinding tools. Precision-shaped grains (PSGs), such as PSGs manufactured by 3M® company, provide significant performance improvement in resin-bond and vitrified bond grinding wheels. The use of PSG improves the performance of portable bonded wheels and precision grinding wheels, such as resin bond roll grinding wheels, flute grinding wheels, vitrified gear grinding wheels, cylindrical grinding wheels, and surface grinding wheels. The formation and composition of (e.g., monolithic) and multiple-layer PSG grinding tools described herein provides improved performance of rail grinding tools.

Various embodiments of the present disclosure provide a bonded abrasive article precursor (100). The bonded abrasive article precursor (100) includes an abrasive layer comprising a plurality of shaped abrasive particles (102) disposed on an adhesive (106) and forming a predetermined pattern.

Various embodiments disclosed relate to a tooling apparatus and method for providing multiple orientation cavities in tooling for abrasive particles in an abrasive article or structure. An example method includes aligning a plurality of shaped abrasive particles into a pattern, including collecting the plurality of shaped abrasive particles at least partially into cavities arranged on a dispensing surface, where at least one of the cavities is configured to allow for multiple orientations of one of the plurality of shaped abrasive particles. The pattern is transferred to a backing substrate containing a layer of adhesive, and the adhesive is cured.

Various embodiments of the present disclosure relate to a shaped abrasive particle transfer assembly. The shaped abrasive particle transfer assembly includes a substrate including an adhesive and a plurality of shaped abrasive particles adhered to the substrate and forming a predetermined pattern thereon.

The present invention provides methods for making a pre-conditioned chemical mechanical (CMP) polishing pad having a pad surface microtexture effective for polishing comprising grinding the surface of the CMP polishing pad having a radius with a rotary grinder while it is held in place on a flat bed platen surface, the rotary grinder having a grinding surface disposed parallel to or substantially parallel to the surface of the flat bed platen and made of a porous abrasive material, wherein the resulting CMP polishing pad has a surface roughness of from 0.01 μm to 25 μm, Sq. The present invention also provides a CMP polishing pad having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad.

A method of making polycrystalline diamond material includes providing a fraction of diamond particles or grains and a sintering additive, the sintering additive comprising a carbon source of nano-sized particles or grains, forming the diamond particles and sintering additive into an aggregated mass, consolidating the aggregated mass and a binder material to form a green body, and subjecting the green body to conditions of pressure and temperature at which diamond is more thermodynamically stable than graphite and for a time sufficient to consume the sintering additive, sintering it and forming polycrystalline diamond material that is thermodynamically and crystallographically stable and is substantially devoid of any nano-structures.

The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.