B24D18/00

Interface Modification of Polycrystalline Diamond Compact
20170246730 · 2017-08-31 ·

A cutting element and a method of providing the cutting element are provided. The cutting element may include a substrate, a first polycrystalline diamond zone, and a second polycrystalline diamond zone. The first polycrystalline diamond zone may be substantially free of a catalyst material. The second polycrystalline diamond zone rich in the catalyst material may be bonded to the substrate along an interface. The second polycrystalline diamond zone may be bonded to the first polycrystalline diamond zone along an effective transition zone. The effective transition zone may have a plurality of irregular projections toward the first polycrystalline diamond zone and the second polycrystalline diamond zone.

TEXTURE PATTERN FOR ABRASIVE TOOL
20170246727 · 2017-08-31 ·

The present disclosure relates to abrasives surfaces located on an outer diameter of a grinding wheel to provide grinding characteristics of both coarse and fine abrasive textures. The grinding wheel has a coarse abrasive portion located at one disclosure uses a transition band formed at an interface between the abrasive surfaces, that has an abrasive coating with a gradual change in texture from a coarse surface to a fine surface.

POLYCRYSTALLINE DIAMOND CUTTING ELEMENTS WITH MODIFIED CATALYST DEPLETED PORTIONS AND METHODS OF MAKING THE SAME
20170247951 · 2017-08-31 ·

Polycrystalline diamond cutting elements with modified catalyst depleted portions and methods of making the same are disclosed herein. A method may include removing inter-bonded diamond grains along an outer surface of a polycrystalline diamond compact to form a frustoconical surface, introducing the polycrystalline diamond compact to a leaching process in which catalyst material that is positioned within interstitial regions between the inter-bonded diamond grains is removed from the polycrystalline diamond compact, and removing inter-bonded diamond grains along the outer surface of the polycrystalline diamond compact to form a polycrystalline diamond cutting element having a peripheral surface.

Polycrystalline diamond compacts having leach depths selected to control physical properties and methods of forming such compacts
11242714 · 2022-02-08 · ·

A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.

Apparatus for printing a chemical mechanical polishing pad

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

Apparatus for printing a chemical mechanical polishing pad

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

Mounting with interconnected cavities for holding an abrasive, method for producing such a mounting, grinding system and use of such a mounting

A mounting element for holding a self-adhesive and/or flexible abrasive includes a supporting plate, and a distributing body. The supporting plate includes a plurality of suction openings which penetrate the supporting plate from a first side to a second side opposite the first side. A first side of the distributing body is in contact with the second side of the supporting plate, and a second side of the distributing body is configured to hold an abrasive. The distributing body includes a plurality of cavities which penetrate the distributing body from the first side of the distributing body to the second side of the distributing body, and which are mutually separated by a plurality of walls. At least one of the walls has at least one aperture which connects at least two adjacent cavities to each other.

Mounting with interconnected cavities for holding an abrasive, method for producing such a mounting, grinding system and use of such a mounting

A mounting element for holding a self-adhesive and/or flexible abrasive includes a supporting plate, and a distributing body. The supporting plate includes a plurality of suction openings which penetrate the supporting plate from a first side to a second side opposite the first side. A first side of the distributing body is in contact with the second side of the supporting plate, and a second side of the distributing body is configured to hold an abrasive. The distributing body includes a plurality of cavities which penetrate the distributing body from the first side of the distributing body to the second side of the distributing body, and which are mutually separated by a plurality of walls. At least one of the walls has at least one aperture which connects at least two adjacent cavities to each other.

COMPOSITE CONDITIONER AND ASSOCIATED METHODS
20170232577 · 2017-08-17 ·

CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a composite conditioner can include a base plate and a plurality of polishing units secured to a surface of the base plate by an adhesive layer, where each polishing unit includes a plurality of polishing tips secured in a binding layer. Additionally, a height difference between a first highest polishing tip and a second highest polishing tip is less than or equal to about 10 μm, a height difference between the first highest polishing tip and a tenth highest polishing tip is less than or equal to about 20 μm, and a height difference between the first highest polishing tip and a 100th highest polishing tip is less than or equal to about 40 μm. Furthermore, the first highest polishing tip protrudes from the binding layer to a height of greater than or equal to about 50 μm.

MULTI-CHAMFER CUTTING ELEMENTS HAVING A SHAPED CUTTING FACE AND EARTH-BORING TOOLS INCLUDING SUCH CUTTING ELEMENTS

A cutting element for an earth-boring tool includes a substrate and volume of superabrasive material positioned on the substrate. The volume of superabrasive material includes a cutting face having at least one recess extending into the volume of superabrasive material and/or at least one protrusion extending outward from the volume of superabrasive material. The volume of superabrasive material includes a first chamfer surface having a peripheral edge and a radially innermost edge. The peripheral edge of the first chamfer surface is located proximate a cutting edge of the volume of superabrasive material. A radial width of the first chamfer surface is between about 0.002 inch and about 0.045 inch. The volume of superabrasive material also includes a second chamfer surface having a peripheral edge and a radially innermost edge. The peripheral edge of the second chamfer surface is located adjacent the radially innermost edge of the first chamfer surface.