The present invention provides a wafer polishing pad, the wafer polishing pad includes a polishing material layer, a plurality of recesses are formed on the top surface of the polishing material layer, and a warning element disposed within the polishing material layer, the warning element and the polishing material layer have different colors. The feature of the invention is that forming a warning element in the polishing material layer, when the visible state of the warning element is changed, for example, when the warning element appears, disappears or changes the shapes, it means that the wafer polishing pad needs to be replaced. In this way, the user can confirm the destroying situation of the wafer polishing pad easily, and also improving the manufacturing process efficiency.

A sanding plaster sponge including an integrated retractable pencil or pen positioned in a channel formed across opposite faces of the sanding plaster sponge; and a pushbutton for positioning a tip of the pencil or pen between retracted and extended positions.

A flexible abrasive article is provided with a first, non-tacky base layer having opposed first and second major surfaces. An ink layer is disposed on the first major surface of the first base layer, while a second, thermoplastic base layer is disposed on the ink layer whereby the ink layer is located between the first and second base layers. Disposed on the second base layer is an abrasive layer such that the second base layer is located between the abrasive layer and the ink layer. Compared with conventional printed flexible adhesive articles, the provided articles improved robustness while avoiding manufacturing difficulties related to flexographic printing onto abrasive coated articles.

Method and system for monitoring a polishing pad is provided. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.

The present invention provides a wafer polishing pad, the wafer polishing pad includes a polishing material layer, a plurality of recesses are formed on the top surface of the polishing material layer, and a warning element disposed within the polishing material layer, the warning element and the polishing material layer have different colors. The feature of the invention is that forming a warning element in the polishing material layer, when the visible state of the warning element is changed, for example, when the warning element appears, disappears or changes the shapes, it means that the wafer polishing pad needs to be replaced. In this way, the user can confirm the destroying situation of the wafer polishing pad easily, and also improving the manufacturing process efficiency.

The disclosed subject matter provides a polishing pad and a monitoring system for monitoring the polishing pad. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.

A knuckle deburring cutter and a method of knuckle for removal of burrs at a lower ball head hole of a knuckle and burrs in the locations where the lower ball head hole, a pinch bolt hole and a pinch bolt slot intersect one another. The knuckle deburring cutter includes a cutter shank in a circular bar shape having a diameter less than that of the lower ball head hole. A deburring cutter head is positioned at an end of the cutter shank with the shape of the deburring cutter head matching that of the pinch bolt hole. A sharp-angle part of lettering is positioned at an end of the deburring cutter head with a width of the sharp-angle of lettering being less than that of the pinch bolt slot. The knuckle deburring cutter and associated method provides benefits, such as low rejection rate, ease of machining, short production rhythm and the like.

The disclosed subject matter provides a polishing pad and a monitoring system for monitoring the polishing pad. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.

An abrasive article includes a body and an electronic assembly coupled to the body, the electronic assembly including an electronic device, and a first portion between the body and the communication device, the first portion having a material of an average relative magnetic permeability of not greater than 15.

The design of a stainless-steel cylindrical tool for manual grinding and polishing of cement-based thin sample (two cylinders one withing the other, connected by the movable threaded holder with a plate, that passes through the middle) enables very precise removal of sample layers to its thickness of 1-mm ( 1/32 inch) and less. The squared, young aged sample rests on the circular plate on a holder, that can be slowly and safely rotated during thin layer removal, to obtain a smooth and flat sample surface, which can produce sharp digital images in ESEM, necessary for detailed and accurate image analysis. The cylindrical tool can be reassembled. It is reusable, easy to maintain and clean. Its design is practical since inner cylinder can be replaced if damaged, with the identically designed inner cylinder or with differently designed inner cylinder adjusted to another sample size.