A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.

A composition of matter comprises at least 10 wt % epoxy functionalized two-dimensional shaped particles, carbon nanotubes in the range of 0.1 to 5 wt %, epoxy resin and a curing agent. A method of manufacturing a composition of matter includes mixing epoxy resin, carbon nanotubes and a solvent to produce a material, drying the material, and mixing the material with a curing agent to product the composition of matter. A method of printing a composition of matter includes producing the composition of matter by combining epoxy functionalized graphene, carbon nanotubes, epoxy base resin, and a curing agent, extrusion printing the composition of matter into a desired pattern, and curing the pattern.

The present invention provides: a surface-coated film which is for being integrally formed with a fiber impregnation resin; a surface-coated fiber-reinforced resin molded product; and a manufacturing method thereof. The surface-coated film has a base film B and an easily adhesive layer A provided on the base film B, wherein the base film B has a flat layer b2 and an easily molded layer b1 adjacent to the easily adhesive layer A, the thickness of the easily adhesive layer A is 30-250 nm, the thickness of the base film B is 50-500 μm, the easily molded layer b1 and the flat layer b2 satisfy both expression 1 of 3≤ratio (EHb2/EHb1) of storage elastic modulus EHb2 of flat layer b2 at 150° C. to storage elastic modulus EHb1 of easily molded layer b1 at 150° C., and expression 2 of 1,000 MPa≤storage elastic modulus ELb1 of easily molded layer b1 at 23° C.

The invention is directed to a method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering. Partial curing of a thermosetting formulation can be used to increase the T.sub.g of the resin and minimize the additional cure needed to cross-link a printed object. After printing, the partially cured material is finally cured via a slow temperature ramp maintained just below the material's evolving T.sub.g.

The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity. The electronic device housing consists mainly of a fiber reinforcing member (a) and a fiber reinforcing member (b), the fiber reinforcing member (a) containing a resin (a1) and a fiber (a2), the fiber reinforcing member (b) containing a resin (b1) and a fiber (b2), the fiber reinforcing member (a) and the fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the fiber reinforcing member (a) and the fiber reinforcing member (b), and the fiber reinforcing member (a) and the fiber reinforcing member (b) fulfilling a specific relation in terms of linear expansion coefficient and/or bending elastic modulus.

An ultrasound probe of the present invention has a piezoelectric element and a backing material disposed on one direction side with respect to the piezoelectric element, the backing material containing heat conductive particles. The backing material has a heat conductivity of 2.0 W/mk or more, and the content of the heat conductive particles is less than 30 vol % based on the total volume of the backing material.

A method of three-dimensional (3D) printing includes applying a solution to a channel. The solution includes a plurality of anisotropic particles suspending in the solution. Acoustic waves are applied to the channel. The frequency of the acoustic waves is configured to organize the plurality of anisotropic particles into one or more columns of organized anisotropic particles. The channel is connected to a printhead and a waste outlet. The solution comprising the one or more columns of organized anisotropic particles is deposited on a substrate via the printhead outlet.

A fiber-reinforced shaped article in which a reinforcing fiber bundle aggregate formed of a plurality of reinforcing fiber bundles converged is impregnated with an epoxy resin composition and the epoxy resin composition is cured, wherein the epoxy resin composition contains at least components [A], [B], [C], and [D], and a quantity of [A] is 60 to 100 parts by mass per 100 parts by mass of all epoxy resin contained in the epoxy resin composition: [A]: aminophenol type epoxy resin; [B]: two kinds of acid anhydrides of [B1]: acid anhydride having a nadic anhydride structure, and [B2]: acid anhydride having a hydrogenated structure of phthalic anhydride; [C]: at least one filler having a Mohs hardness of 3 or less selected from the group consisting of a silicon compound, a magnesium compound, a calcium compound, an aluminum compound, and inorganic carbon; [D]: a release agent.

An object of the present invention is to provide a prepreg and a laminate for producing a laminate suitable as a structural material, which have excellent compressive strength and interlaminar fractural toughness values, and can be firmly integrated with another structural member by welding. The present invention provides a prepreg including the following structural components [A] reinforcing fibers, [B] a thermosetting resin, and [C] a thermoplastic resin, in which [B] has a rubbery state elastic modulus of 10 MPa or more at a temperature obtained by adding 50° C. to a glass transition temperature in a state in which a degree of cure is 90% or more, [C] is present in a surface of the prepreg, and the reinforcing fibers [A] are present, which are included in a resin area including {B] and a resin area including [C] across an interface between the two resin areas.

An ink formulation for additive manufacturing of low density syntactic foams is described. The ink formulation can include a thermoset resin, a curing agent suitable for use with the thermoset resin, a plurality of hollow spheres, such as glass microballoons, one or more solvents, and one or more non-hollow, viscosity modifying filler. Also described are a method of preparing the ink formulation, a method of preparing three-dimensional objects comprising low density syntactic foams, and the three-dimensional objects prepared thereby.