Mist management systems are configured for a processing machine having a portioning station configured to portion a workpiece within an enclosed portioner housing having a first side wall extending along the portioning station, a second side wall, at least one hood portion between the first and second side walls, and at least one end wall between the first and second side walls, using at least one liquid jet cutter and a conveyor configured to move the workpiece in a longitudinal direction beneath the at least one liquid jet cutter. The systems may include a tray secured within the enclosed portioner housing beneath the at least one liquid jet cutter and the conveyor, the tray being downwardly angled and configured to direct a waterjet of the liquid jet cutter toward a low pressure plenum chamber positioned external to the first side wall of the enclosed portioner housing.

A device incorporated into a waterjet cutting machine provided with at least one receiving tank and a movable nozzle, the device being capable of sensing a high-pressure waterjet coming out of the nozzle and including a movable receptacle arranged inside the receiving tank in line with the nozzle, the lower portion of the receptacle being connected to a flexible pipe connected to the bottom of the receiving tank, and—a drive for supporting and moving at least part of the receptacle including the pipe assembly, the drive including a driving member rigidly connected to the nozzle, and a driven member attached to the receptacle, the driving member and the driven member not being mechanically connected.

An abrasive waterjet system in accordance with an embodiment of the present technology includes a cutting head, a catcher downstream from the cutting head, and a conveyance configured to carry slurry including abrasive material and liquid collected from the catcher toward the cutting head. The cutting head includes a jet-forming orifice and a mixing chamber downstream from the jet-forming orifice. The cutting head also includes a slurry inlet through which the mixing chamber receives slurry including abrasive material and liquid collected from the catcher. The abrasive waterjet system can be configured for substantially closed-loop recycling of wet abrasive material. This can be useful, for example, to increase abrasive material utilization efficiency and to decrease abrasive material disposal costs. These and/or other benefits may be realized both in the context of low pressure abrasive waterjet systems and in the context of high pressure abrasive waterjet systems.

Disclosed herein are plaster boards that include first and second layers of hardened plaster material, a liner attached to the first layer of hardened plaster material, and a first material (e.g., a polymer material such as a viscoelastic polymer) adhered between the liner and the second layer of hardened plaster material. The liner includes one or more structurally weakened regions each extending substantially from a first edge to a second opposing edge of the plaster board. The structurally weakened regions of the liner may facilitate creation of a fissure that propagates substantially within a plane within the plaster board. Methods for making the plaster boards may involve drying wet plaster material while it is in contact with a liner having structurally weakened regions, processing a liner to form its structurally weakened regions while in contact with wet plaster material, or processing a liner to form its structurally weakened regions while in contact with hardened plaster material.

An impact tool includes a core and a plurality of projections. The core is formed of a first material that has a first specific gravity and each projection is formed of a second material that has a second specific gravity. The plurality of projections is configured on the core such that at least two projections intersect a first hypothetical plane disposed on the first side of the core and at least two projections intersect a second hypothetical plane disposed on the second side of the core and that is opposably facing the first side. Each of the first and second hypothetical planes is disposed a distance from the central lengthwise axis of the core that is greater than the radius of the core and less than the sum of the radius of the core and the length of a projection.

An impact tool includes a core and a plurality of projections. The core is formed of a first material that has a first specific gravity and each projection is formed of a second material that has a second specific gravity. The plurality of projections is configured on the core such that at least two projections intersect a first hypothetical plane disposed on the first side of the core and at least two projections intersect a second hypothetical plane disposed on the second side of the core and that is opposably facing the first side. Each of the first and second hypothetical planes is disposed a distance from the central lengthwise axis of the core that is greater than the radius of the core and less than the sum of the radius of the core and the length of a projection.

A separating device (10) for separating a tubular flat material (1) having an actual tube width (1.1), comprising at least one longitudinal separating unit (20) for removing a first edge region (2) and a second edge region (3) of the flat material (1) is provided. In addition, a separating method (100) for separating a tubular flat material and to a system (70) having a separating device (10) is provided.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled. According to certain embodiments, an in-plane shear component (KII) is maintained near zero, sandwiched between a tensile region and a compressive region. In one embodiment, cleaving can be accomplished using a plate positioned over the substrate surface. The plate serves to constrain movement of the film during cleaving, and together with a localized thermal treatment reduces shear developed during the cleaving process. According to other embodiments, the KII component is purposefully maintained at a high level and serves to guide and drive fracture propagation through the cleave sequence.

A method for determining a spatial position of a liquid jet, in particular of a liquid jet for optically guiding a laser beam, comprises the steps: providing a collision object having a measuring point for interacting with the liquid jet, detecting a state of the liquid jet in a first configuration between collision object and liquid jet, changing the configuration so that the state of the liquid jet changes, detecting the configuration change between the first and second configuration.