Patent classifications
B28D1/00
METHOD FOR CUTTING POLYCRYSTALLINE SILICON ROD, METHOD FOR MANUFACTURING CUT ROD OF POLYCRYSTALLINE SILICON ROD, METHOD FOR MANUFACTURING NUGGET OF POLYCRYSTALLINE SILICON ROD, AND POLYCRYSTALLINE SILICON ROD CUTTING DEVICE
Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).
Brick/block laying machine incorporated in a vehicle
A self-contained truck-mounted brick laying machine can include a frame that can support packs or pallets of bricks placed on a platform. A transfer robot can pick up and move the brick(s). A carousel can be coaxial with a tower. The carousel can transfer the brick(s) via the tower to an articulated and/or telescoping boom. The bricks can be moved along the boom by, e.g., linearly moving shuttles, to reach a brick laying and adhesive applying head. The brick laying and adhesive applying head can mount to an element of the stick, about an axis which is disposed horizontally. The poise of the brick laying and adhesive applying head about the axis can be adjusted and can be set in use so that the base of a clevis of the robotic arm mounts about a horizontal axis, and the tracker component is disposed uppermost on the brick laying and adhesive applying head. The brick laying and adhesive applying head can apply adhesive to the brick and can have a robot that lays the brick. Vision and laser scanning and tracking systems can be provided to allow the measurement of as-built slabs, bricks, the monitoring and adjustment of the process and the monitoring of safety zones. The first, or any course of bricks can have the bricks pre machined by the router module so that the top of the course is level once laid.
Apparatus for cleaning boreholes within substrates
Cleaning implement apparatus for cleaning boreholes formed within various different substrates, such as, for example, concrete slabs, concrete blocks, bricks, or the like, comprises a first embodiment for use within a power-operated tool, such as for example, a roto-hammer type power tool for drilling boreholes within concrete or brick substrates, while a second embodiment of the apparatus comprises a manually-operated tool. The first embodiment comprises a bit member having a slotted drive shank (SDS) connection for mounting within the chuck mechanism of the roto-hammer type power tool. In this manner, the same roto-hammer type power tool can be used for both drilling the borehole within the substrate as well as for cleaning the borehole by exchanging the cleaning implement for the drill bit.
Dynamic compensation of a robot arm mounted on a flexible arm
A control system for a base supporting a boom assembly comprises long telescopic boom and telescopic stick. Mounted to the remote end of the stick is an end effector that supports a robot arm that moves a further end effector to manipulate the items. The robot arm has a robot base, and mounted above the robot base is a first target in the form of a position sensor, that provides position coordinates relative to a fixed ground reference. Mounted on the end of the robot arm immediately above the end effector is a second target that provides position coordinates relative to the fixed around reference. The fixed ground reference tracks the sensors and feeds data to the control system to move the stick with slow dynamic response and to control movement of the robotic arm and end effector with fast dynamic response.
CONCRETE RESTORATION AND ORNAMENTATION METHOD AND APPARATUS
A method and apparatus is provided to rehabilitate and beautify cracked concrete surfaces by adding channels that look like the cracks to the surface.
Drilling and cutting device
A drilling and cutting device for both drilling and cutting through large objects is provided. The drilling and cutting device provides a plurality of cutting elements spaced apart and connected along a cutting chain that is operatively connected to a driven gear. The cutting chain is mounted along a periphery of a guide bar adapted to force the cutting chain to move on a certain path laterally, longitudinally or rotatably when selectively engaged to a mounting assembly.
Vibrating type hard rock cutting mechanism with function of directional high-speed abrasive jet advanced slitting
A vibrating type hard rock cutting mechanism with a function of directional high-speed abrasive jet advanced slitting includes a disc-shaped hob, a cutting main shaft and a valve plate. When the vibrating type hard rock cutting mechanism works, an outlet of a high-pressure abrasive jet generating system is communicated to a cutting mechanism abrasive jet inlet. An abrasive jet enters an abrasive jet nozzle through flow channels in the valve plate, the cutting main shaft and the disc-shaped hob and forms a directional high-speed abrasive jet. The cutting main shaft is directly driven to rotate by an axial permanent magnet motor. The cutting mechanism enables the disc-shaped hob to vibrate under the action of a vibration motor. A macro crack is formed on a rock mass by rotating the abrasive jet. The rotating disc-shaped hob can be wedged into the formed crack in a vibration manner by swinging the cutting mechanism.
Slab cutting apparatus and method
Systems and methods are described for finishing slabs. In an exemplary embodiment, a stone-cutting miter saw includes a support fixture that is configured to support a stone slab, a guide rail, and cutting and grinding heads movably supported on the guide rail.
Method for the material-saving production of wafers and processing of wafers
The invention relates to a method for producing a multi-layer assembly. The method according to the invention comprises at least the following steps: providing a donor substrate (2) for removing a solid layer (4), in particular a wafer; producing modifications (12), in particular by means of laser beams (10), in the donor substrate (2) in order to specify a crack course; providing a carrier substrate (6) for holding the solid layer (4); bonding the carrier substrate (6) to the donor substrate (2) by means of a bonding layer (8), wherein the carrier substrate (6) is provided for increasing the mechanical strength of the solid layer (4) for the further processing, which solid layer is to be removed; arranging or producing a stress-producing layer (16) on the carrier substrate (6); thermally loading the stress-producing layer (16) in order to produce stresses in the donor substrate (2), wherein a crack is triggered by the stress production, which crack propagates along the specified crack course in order to remove the solid layer (4) from the donor substrate (2) such that the solid layer (4) is removed together with the bonded carrier substrate (6).
FLOOR GRINDING MACHINE
A floor grinding machine includes a supporting frame, a grinding unit attached to the supporting frame, and a drive unit connected to the grinding unit. The grinding unit includes an upper housing, a lower housing rotatably arranged in relation to the upper housing, and a planetary drive system connected to the drive unit. The upper housing includes a first side wall. The lower housing includes a bottom plate and a second side wall. One or more grinding disks adapted for holding a tool are rotatably attached to the bottom plate. The planetary drive system is arranged to rotate the lower housing and the one or more grinding disks. The first side wall at least partly overlaps the second side wall. A gap is formed in a radial direction between the first side wall and the second side wall, and a sealing element is arranged in the gap.