A wafer processing method is disclosed to divide a wafer of glass substrate into individual chips along division lines. In the shield tunnel forming step, a pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at a region corresponding to each division line so that a plurality of shield tunnels which are each formed of perforations and affected regions surrounding the perforations are formed along the division lines, respectively. In the modified layer forming step, another pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at the region corresponding to each division line so that modified layers are formed in addition to the shield tunnels along the division lines, respectively. In the dividing step, an external force is applied to the wafer to divide the wafer into individual chips.

A process of forming a non-optically detectable authentication marking (110), includes the step of: applying a marking at a surface of a diamond (200) using a focused ion beam (FIB) writing process so as to provide a non-optically detectable authentication marking (110) which is formed by alteration in the optical characteristics of a portion of the diamond material at the outer surface of the diamond to form a marked portion; wherein the marking is optically invisible, and wherein the marking is viewable by an imaging method which provides an observable contrast between the portion of the diamond having altered optical characteristics and the non-marked portion of the diamond. The marking process can assist in the prevention of the counterfeiting of precious articles, and be of assistance in the incident of theft. A marking, a diamond, a process of viewing a marking on a diamond are further disclosed.

Provided is: a method of manufacturing plate-like members and an intermediate body for plate-like members whereby the occurrence of shape defects in the plate-like members can be prevented; and a plate-like member in which shape defects are prevented. The method includes the steps of: providing a first breaking groove 12a in a first principal surface of a base material for plate-like members, the base material having the first principal surface and a second principal surface opposed to each other, and then providing a second breaking groove 13a in the second principal surface of the base material in a direction crossing the first breaking groove 12a in plan view to form an intermediate body 11 for wavelength conversion members (plate-like members); and breaking the intermediate body 11 for wavelength conversion members into separate parts along one of the first breaking groove 12a and the second breaking groove 13a and then breaking the intermediate body 11 for wavelength conversion members into separate parts along the other breaking groove, wherein in breaking the intermediate body 11 for wavelength conversion members into separate parts along the first breaking groove 12a, the intermediate body 11 is broken into separate parts along the first breaking groove 12a by pressing the intermediate body 11 from the second principal surface 11b side, and in breaking the intermediate body 11 for wavelength conversion members into separate parts along the second breaking groove 13a, the intermediate body 11 is broken into separate parts along the second breaking groove 13a by pressing the intermediate body 11 from the first principal surface 11a side.

A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: irradiating the resin layer with a laser beam L1 oscillated from a CO.sub.2 laser source along scheduled dividing lines DL of the composite material to form a processing groove along the scheduled dividing lines; and irradiating the brittle material layer with a laser beam L2 oscillated from an ultrashort pulsed laser source along the scheduled dividing lines to form a processing mark along the scheduled dividing lines. In the resin removing step, in a region IS where the scheduled dividing lines intersect, the laser beam oscillated from the CO.sub.2 laser source is not irradiated multiple times, or an irradiation amount of the laser beam is decreased relative to an irradiation amount in a region other than a region where the scheduled dividing lines intersect.

A method for creating a detachment zone in a solid includes: providing a solid which is to be processed; providing a laser light source; subjecting the solid to laser radiation from the laser light source so that laser beams penetrate into the solid via a surface of the solid portion that is to be cut off; applying the laser radiation in a defined manner to a predefined portion of the solid inside the solid such that a detachment zone or a plurality of partial detachment zones is formed; wherein a number of modifications are successively created in the crystal lattice by the applied laser radiation, and the crystal lattice fissures at least partially in the regions surrounding the modifications as a result of the modifications, the fissures in the region of the modifications predefining the detachment zone or the plurality of partial detachment zones.

A method of forming a package structure includes the following steps. A first package structure is formed. The first package structure is connected to a second package structure. The method of forming the first package structure includes the following steps. A redistribution layer (RDL) structure is formed. A die is bonded to the RDL structure. The RDL structure is electrically connected to the die. A through via is formed on the RDL structure and laterally aside the die. An encapsulant is formed to laterally encapsulate the through via and the die. A protection layer is formed over the encapsulant and the die. A cap is formed on the through via and laterally aside the protection layer, wherein the cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the protection layer. The cap is removed from the first package structure.

A method of forming a package structure includes the following steps. A first package structure is formed. The first package structure is connected to a second package structure. The method of forming the first package structure includes the following steps. A redistribution layer (RDL) structure is formed. A die is bonded to the RDL structure. The RDL structure is electrically connected to the die. A through via is formed on the RDL structure and laterally aside the die. An encapsulant is formed to laterally encapsulate the through via and the die. A protection layer is formed over the encapsulant and the die. A cap is formed on the through via and laterally aside the protection layer, wherein the cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the protection layer. The cap is removed from the first package structure.

A silicon carbide wafer manufacturing method includes: a bending measuring step of measuring a first edge having the greatest degree of a bending at one surface of a silicon carbide ingot having one surface; a cutting start step of starting a cutting at a second edge having a distance of r×a along an edge of the one surface from the first edge in a direction parallel to or with a predetermined off angle with respect to the one surface through the wire saw, a cutting speed being decreased to a first cutting speed in the cutting start step; a cutting proceeding step in which the first cutting speed is substantially constant within a variation of about ±5% of the first cutting speed; and a finish step in which the cutting speed is increased from the first cutting speed and the cutting of the silicon carbide ingot is completed.

A cutting apparatus for cutting a workpiece includes a cutting unit for cutting the workpiece with a cutting blade, a moving unit for moving the cutting unit, a delivery pad for delivering the workpiece, and a counterbalance assembly connected to the delivery pad, for applying a pull-up force to the delivery pad. The delivery pad holds the workpiece under suction while being mounted on the moving unit and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

Method and systems are presented for authentication of precious stones, according to their natural ID and/or predetermined markings created in the stones, based on unique characteristic radiation response of the stone to predetermined primary radiation.