A method for controlling a wall saw system during creation of a separation cut in a workpiece between a first and second end point, is disclosed. The separation cut is carried out in a plurality of main cuts. In addition to the main-cut sequence, an overcut sequence having at least two overcuts is defined for each end point defined as a free end point. For each overcut sequence, a starting position and an end position are defined, the overcuts being carried out therebetween. The wall saw is positioned in the starting position and is pivoted into a first overcut angle; subsequently, the saw head is moved by way of the inclined saw arm until the end position has been reached. The wall saw is displaced back into the starting position and pivoted into a second overcut angle. This sequence is repeated until all of the overcuts have been carried out.

Tool bodies, tools and machines for operating the tool include electronic circuits for providing data, collecting data, analyzing data and for controlling machines based on such data. Tool bodies and tools may include electronic circuits having data collecting sensors, which may be embedded in a housing with the electronic circuit and/or positioned outside of such a housing. Sensors include temperature sensors, motion sensors, strain sensors, moisture sensors, electrical resistance sensors, position sensors, antennas, and other components.

A device comprising: a bracket adapted to be coupled to a distal end of a robotic arm; a tool holder coupled to said bracket and configured for changeably receiving a first portion of a stone working tool, wherein said tool is movable in a reciprocating axial direction; a driving element for driving said tool distally along said axial direction during a power stroke of said device; and a guiding element for changeably receiving a body portion of said tool and for guiding said tool in said axial direction, wherein said guiding element is configured to resiliently return said tool proximally along said axial direction after said power stroke.

Semiconductor wafers are produced from a workpiece by means of a wire saw, by feeding the workpiece through an arrangement of wires tensioned between wire guide rollers and divided into wire groups, the wires moving in a running direction producing kerfs as wires engage the workpiece. For each of the wire groups, a placement error of the kerfs of the wire groups determined, and for each of the wire groups compensating movements of the wires of the wire group are induced as a function of the placement error, in a direction perpendicular to the running direction of the wires during feeding of the workpiece through the arrangement of wires, by activating at least one drive element.

A device system, including a remote control (13) having a device housing (31) and a first radio unit (38), a tool device with a second radio unit and a radio link which connects the first radio unit (38) of the remote control (13) to the second radio unit of the tool device. The first radio unit is (38) is arranged on a front side (57) of the device housing (31), wherein the front side (57) is lying opposite a rear side (56) of the device housing (31) facing the operator in a working position of the remote control (13).

A numeric-control work centre can be used for carrying out cutting operations or grinding and/or milling operations on plates of stone, marble, or, in general, natural or synthetic stone material, or ceramic material. The work centre comprises at least one working head movable along at least two mutually orthogonal horizontal axes on a work surface. The work surface includes a rigid supporting board, which defines a first planar supporting surface, and a series of sacrificial elements rigidly connected to the rigid supporting board. The sacrificial elements are arranged in positions spaced apart from each other and define a second supporting surface located at a higher level than the first planar supporting surface, so that a cutting tool coupled to the working head engraves the sacrificial elements, without interfering with the supporting board during a cutting operation on a plate resting on the sacrificial elements, whichever is the path followed by the cutting tool. Between the sacrificial elements there remain free portions of the planar surface of the supporting board, so that they can be removably engaged by one or more blocks for supporting and holding the plate. These blocks project above the sacrificial elements and are adapted to define a third supporting surface, located at a higher level than the second supporting surface, for supporting and holding a plate during a milling or grinding operation on the plate.

A method of machining at least one concrete part includes providing at least one concrete part; applying at least one marking to the at least one concrete part; arranging at least one machining device for machining the at least one concrete part relative to the at least one concrete part; detecting the at least one marking by at least one marking detection device and transmitting the marking data thus generated to the at least one machining device; and machining the at least one concrete part using the generated marking data by the at least one machining device.

An in-situ square sample acquisition device and method for a bond contact test of a surrounding rock and a shotcrete layer are provided, the device includes a supporting shell, a fixing structure, hollow adjusting bolts and two borehole positioning frames, a guide hole is provided in a middle of the supporting shell, the frames are slidably fit in the guide hole, a plurality of positioning holes are provided in side walls of each of the frames, and the positioning holes in different frames are distributed in a staggered manner, four corners of the supporting shell are connected with four hollow adjusting bolts respectively, one end of each of the hollow adjusting bolts is fixedly provided with an adjusting nut, four fixing lugs are provided in four corners of each frame respectively, and the fixing structure includes four connecting bolts and four nuts.

The present disclosure provides a method and a device for cutting a solar silicon wafer, and a storage medium, which relate to the technical field of crystalline silicon cutting and can solve a problem of high labor intensity of operators caused by repeated operation in solar silicon wafer cutting, improve production efficiency and reduce misoperation. A technical solution is specifically as follows: loading materials to be cut to a section cutter (101); adjusting a cutting wire mesh according to preset requirements, starting a cutting procedure when cutting conditions are met, and cutting the materials to be cut (102); generating prompt information for completed cutting after the cutting is completed (103); and unloading cut materials from the section cutter according to the prompt information for the completed cutting (104). The present disclosure is used for silicon wafer cutting.

The present invention provides a cutting work method comprising a cutting work step of forming a through-groove passing through from a surface to a back face of a workpiece material by cutting the workpiece material with a cutting tool while bringing a lubricant material for assisting cutting process into contact with the cutting tool and/or the to-be-processed portion of the workpiece material, wherein the workpiece material comprises one or more materials selected from the group consisting of a metal, a fiber reinforced plastic, ceramic, and a composite material thereof.