B29C66/00

BONDING FIXTURE AND BONDING DEVICE WITH THE SAME

A bonding fixture is used for fixing a flexible panel having a side edge comprising an edge part and corner parts, and an edge of at least one of the two corner parts is curve. The bonding fixture comprises a fixture body comprising a first profiling base configured for supporting the edge part; and a second profiling base arranged at at least one end of the first profiling base in a first direction, a length of the second profiling base in the first direction is equal to that of the corner parts in the first direction; the second profiling base is provided with a second profiling part configured for supporting the corner parts; in a second direction, the second profiling part extends beyond the first profiling base in a direction away from a center of the bonding fixture, and the second direction is perpendicular to the first direction.

EXTERNAL ELECTRONIC DEVICE

A light-transmitting plastic casing and a manufacturing method thereof are provided. A manufacturing method of a light-transmitting plastic casing include the steps: providing a mixed material, the mixed material includes a resinous material, a flame retardant material, a transparent fiberglass material, and an elastomer material; performing a granulating step to the mixed material to form granules; performing a heating step to the granules; and performing a molding step to heated granules to form a light-transmitting plastic casing.

PRODUCT AND METHOD FOR ADHERING INDICIA TO A FLEXIBLE SUBSTRATE
20210139183 · 2021-05-13 ·

A method for adhering a label, lettering, ink, a tattoo, sketch, design or color (indicia) to a substrate comprising the steps of: providing an indicia-bearing backing paper; moistening the indicia-bearing backing paper to form a moistened indicia-bearing layer; providing an adhesive layer between the moistened indicia-bearing layer and the substrate; placing the moistened indicia-bearing layer on the adhesive layer; allowing the indicia to become separated from the backing paper, leaving the indicia upon the substrate; and drying on the substrate.

STRUCTURAL SUPPORT, MANUFACTURING PROCESS
20200123799 · 2020-04-23 ·

Structural support (1) including a first support portion (2) delimiting at least one containment compartment (4, 4); a second support portion (6) at least partly in front of the containment compartment (4, 4); and a sliding element (4), housed in the containment compartment (4, 4) and interposed between the first (2) and the second (6) support portion. The sliding element (8) substantially consists of a thermo-processable fluoro-polymer with a melt-mass flow rateaccording to the ISO 1133-1:2011 standardof less than 5.0 grams/10 minutes, for example under 3.0 grams/10 minutes.

Lap shear bonding fixture

A fixture for lap shear bonding a bottom panel to a top panel comprises a bottom tool, a first spacer, a second spacer, and a top tool. The bottom tool has a quadrilateral shape including a top surface, a bottom surface, and four side surfaces and is configured to retain the bottom panel on the top surface. The first spacer is attached to the top surface of the bottom tool adjacent to one edge. The second spacer is attached to the top surface of the bottom tool adjacent to an opposing edge. The top tool has a quadrilateral shape including a top surface, a bottom surface, and four side surfaces and is configured to retain the top panel on the bottom surface. The top tool is further configured to attach to the first spacer and the second spacer such that the top panel contacts the bottom panel.

Additive manufacturing of a body component on a tube frame

Methods and devices for manufacturing paneled structures are provided. The methods include manufacturing a frame structure by additive manufacturing methods and scanning a surface of the frame structure to determine whether there is more than a nominal surface deviation at a location where a panel will be disposed. When there is more than a nominal surface deviation, the methods also include generating a panel to be disposed at the location of the frame structure, wherein the panel has an engagement surface that is complimentary to the surface deviation.

HEAT-DISSIPATING FILM, AND ITS PRODUCTION METHOD AND APPARATUS
20190338176 · 2019-11-07 ·

The present invention relates to a heat-dissipating film. The heat-dissipating film comprises a heat-conductive layer comprising fine graphene particles and carbon nanotube uniformly dispersed, a mass ratio of the carbon nanotube to the total of the fine graphene particles, wherein the carbon nanotube is 0.05-0.2, and the fine graphene particles are substantially aligned with the heat-conductive layer, and the heat-conductive layer has a density of 1.9 g/cm.sup.3 or more and thermal conductivity of 600 W/mK or more.

Composite product with junction structure

A composite product having a junction structure includes a first unit formed of a composite material, a first connector formed of a metal and provided with one end inserted into one end of the first unit and formed integrally with the first unit and another end extending outwards from the first unit, a second unit formed of a composite material, and a second connector formed of a metal and provided with one end inserted into one end of the second unit and formed integrally with the second unit and another end extending outwards from the second unit, wherein the other end of the first connector and the other end of the second connector are joined and fixed by welding under a condition that the ends of the first unit and the second unit are opposite each other adjacently.

Apparatus and methods for transferring and bonding substrates

A substrate assembly is mechanically deformed to form various products. In part, the substrate assembly may advance toward a bonder apparatus. The bonder apparatus rotates about a longitudinal axis and includes a plurality of manifolds. The plurality of manifolds allow for substrate assemblies including different process product pitches to be processed on a single bonder apparatus.

Apparatuses and methods for transferring and bonding substrates

A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may advance toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation. The bonder apparatus may include a plurality of manifolds positioned about the axis of rotation. The substrate assembly may be advanced onto the bonder apparatus such that the substrate assembly is disposed on the plurality of manifolds. Fluid may be passed to the manifolds onto which the leading edge portion and the trailing edge portion of the substrate assembly are disposed. The manifolds may heat the fluid and the heated fluid may be released onto the trailing edge portion and the leading edge portion of the substrate assembly. The heated portion of the substrate assembly may then be bonded forming a seam.