The present invention relates to the treatment or prevention of skeletal disorders, at particular skeletal diseases, developed by patients that display abnormal increased activation of the fibroblast growth factor receptor 3 (FGFR3), in particular by expression of a constitutively activated mutant of FGFR3.

A photocurable resin composition for three-dimensional modeling containing a polyfunctional radically polymerizable compound (A), a monofunctional radically polymerizable compound (B), a polysilsesquioxane-containing particle (C), and a curing agent (D), wherein the polyfunctional radically polymerizable compound (A) has an ethylenically unsaturated group equivalent of 700 g/eq or more and 7,000 g/eq or less, and a polysilsesquioxane-containing particle (C) content is 5 parts by mass or more and 50 parts by mass or less per 100 parts by mass of the polyfunctional radically polymerizable compound (A) and the monofunctional radically polymerizable compound (B) in total.

A curable composition is provided. The curable composition contains a multifunctional urethane (meth)acrylate monomer (component 1), a (meth)acrylate monomer (component 2), and an inorganic filler (component 3). A mass content ratio (component 1:component 2) of the component 1 to the component 2 is from 65:35 through 40:60.

Provided among other things is an polymeric protective garment comprising a layer of carboxylated polymer that incorporates an alumina-silica composition, thus forming a silica alumina polymer composite.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

A resin layered body includes a polycarbonate-based resin (A); a thermoplastic resin (B) on at least one surface of the polycarbonate-based resin (A); and a hard coating layer on a surface of the thermoplastic resin (B) on at least one side, wherein the polycarbonate-based resin (A) has a glass-transition temperature from 115° C.-140° C., the thermoplastic resin (B) includes a methacrylic resin (C) and a styrene copolymer (D), a content of the methacrylic resin (C) is from 5-70 parts by mass and a content of the styrene copolymer (D) is from 95-30 parts by mass based on 100 parts by mass of a total content of the methacrylic resin (C) and the styrene copolymer (D), and the styrene copolymer (D) includes a vinyl aromatic monomer unit (d1) in an amount of from 68-84 mass % and a cyclic acid anhydride monomer unit (d2) in an amount of from 16-32 mass %.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

Provided a resin sheet excellent in both flame retardancy and impact resistance. The resin sheet according to the present invention is a resin sheet including an aromatic polycarbonate resin; an inorganic filler; a phosphorus-containing compound; and a silicon-containing compound, the resin sheet having a first surface on one side in a thickness direction; and a section in a direction perpendicular to the first surface, the section having segmentation areas of the inorganic filler, and the resin sheet having a ratio of a standard deviation of the segmentation areas to an average of the segmentation areas, the ratio being 0.53 or less, the segmentation areas each calculated by a segmentation method.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22 C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23 C.