Provided is a fiber-reinforced resin material molding in which fluctuations of the dispersion state of the fiber bundle in the molding is small, the generation of a resin pool is suppressed, and fluctuations in physical properties such as tensile strength and modulus of elasticity are suppressed; a method for manufacturing the same, and a method for manufacturing a fiber-reinforced resin material. Provided is a fiber-reinforced resin material molding comprising: a fiber bundle comprising a plurality of reinforcing fibers; and a matrix resin, wherein a coefficient of variation in fiber content of the reinforcing fibers per unit zone of 0.1 mm square on a cut face along a thickness direction is 40% or less.

A transaction card, and processes for the manufacture thereof, having a core layer, optionally, one or more layers or coatings over the core layer, and at least one of a magnetic stripe, a machine readable code, and a payment module chip disposed in or on the card and suitable for rendering the card operable for conducting a transaction. The core layer comprises a metal-doped cured epoxy comprised of metal particles distributed in a binder consisting essentially of a cured, polymerized epoxy resin, the core comprising greater than 50%, preferably greater than 75%, and more preferably greater than 90%, of the weight and/or volume of the card. In some embodiments, the core includes a metal insert enveloped with the metal-doped curable epoxy, wherein the periphery of the epoxy extends beyond the periphery of the metal insert and has material properties more conducive to cutting or punching than the metal insert.

A method of manufacturing a semiconductor device includes providing, in a housing, an insulating substrate having a metal pattern, a semiconductor chip, a sinter material applied on the semiconductor chip, and a terminal, providing multiple granular sealing resins supported by a grid provided in the housing, heating an inside of the housing until a temperature thereof reaches a first temperature higher than a room temperature and thereby discharging a vaporized solvent of the sinter material out of the housing via a gap of the grid and a gap of the sealing resins, and heating the inside of the housing until the temperature thereof reaches a second temperature higher than the first temperature and thereby causing the melted sealing resins to pass the gap of the grid and form a resin layer covering the semiconductor chip.

A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

An electrically decoupled jet engine. The electrically decoupled jet engine includes a combustion chamber which creates a toroidal flow of air and a rotational electric motor which drives a fuel supply into the combustion chamber. The toroidal flow of air is mixed with the fuel and combusted in the combustion chamber to create thrust.

The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.

The disclosure relates to a method of manufacturing a fibre reinforced composite, wherein the surface of the fibre reinforced composite modified by using a laser radiation. In particular, the pre-treatment is performed before a bonding process. Time-consuming and dust generating grinding of the surface can be avoided.

The disclosure relates to a method of manufacturing a fibre reinforced composite, wherein the surface of the fibre reinforced composite modified by using a laser radiation. In particular, the pre-treatment is performed before a bonding process. Time-consuming and dust generating grinding of the surface can be avoided.

A structural reinforcement for an article including a carrier that includes: (i) a mass of polymeric material having an outer surface; and (is) at least one consolidated fibrous insert having an outer surface and including at least one elongated fiber arrangement having a plurality of ordered fibers arranged in a predetermined manner. The fibrous insert is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert and the mass of polymeric material are of compatible materials, structures or both, for allowing the fibrous insert to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier will be a mass of activatable material.

A method for bonding two elements, the method including receiving first and second elements, the first element being a composite material; applying a laser-based treatment to a surface of the first element to obtain a treated surface; patterning the treated surface to have plural trenches; applying an adhesive to one of the first and second elements; and joining the first element to the second element so that the adhesive is between the first and second elements.