A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.

A system for fabricating a composite article includes a pre-impregnation station for forming a prepreg comprising a reinforcement impregnated with a resin. The prepreg is provided to a blanking station where a blank is cut from the partially cured prepreg and arranged onto a preforming mold. The blank is then transferred to a forming station, and is formed into the composite article using a compression mold. The pre-impregnation station, the blanking station and the forming station are co-located. During forming of the blank into the composite article using the compression mold, additional prepreg is formed in the pre-impregnation station and passes to the blanking station so as to form a next blank for being formed into a next composite article during a subsequent molding cycle. Optionally, the prepreg is partially cured prior to being cut in the blanking station.

A process for the production of manufactured articles in composite material comprises at least one supply phase of a plurality of layers and at least one coupling phase of the layers. The coupling phase comprises at least one step of arrangement of the layers overlapped onto each other to create at least one stratified body. The coupling phase comprises at least one step of positioning the stratified body inside a mould. The coupling phase comprises at least one firing step of the layers positioned inside the mould. The supply phase comprises at least one supply step of at least one basic layer and at least one supply step of at least one reinforcement layer.

Methods to increase structural performance, strength, and durability of textile-reinforced composite materials are provided. The textile reinforcement may be knitted, for example, in a flat bed weft knitting machine. The method may include pre-stressing a textile reinforcement preform by applying tension. A polymeric precursor may be introduced to the pre-stressed textile reinforcement preform. The polymeric precursor may then be cured or consolidated, followed by releasing of the applied tension to form the composite article comprising polymer and the pre-stressed textile reinforcement. In other aspects, a composite article is provided that has a pre-stressed textile reinforcement structure and a cured polymer. The textile reinforcement may be a knitted, lightweight, seamless, unitary structure. The knitted reinforcement structure may have distinct first and second knitted regions with different levels of pre-stress, thus providing enhanced control over strength, rigidity, and flexibility of the composite article.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

A method for manufacturing optical and microwave reflectors includes: placing an assembly comprising a resin-infiltrated tendrillar mat structure on a mandrel; placing a pre-impregnated carbon fiber (CF) lamina on top of the tendrillar mat structure; placing the assembly in a vacuum device so as to squeeze out excess resin; and placing the assembly in a heating device so as to cure the tendrillar mat structure together with the CF lamina, forming the CF laminae into a laminate that combines with the tendrillar mat structure to create a cured assembly. A reflector suitable for one or more of optical and microwave applications includes: a mandrel; a resin-infiltrated tendrillar mat structure placed on the mandrel; and a pre-impregnated carbon fiber (CF) lamina placed on top of the tendrillar mat structure.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty epoxy composition comprising at least one epoxy resin, at least one monomer and/or prepolymer that is polymerizable by exposure to radiation and at least one photoinitiator, wherein the pasty epoxy composition has a viscosity factor (1.5/15) of at least 2 at application temperature.

There is disclosed a method of applying activatable material to a member of an article of manufacture such as an automotive vehicle. According to the method, the activatable material is provided to an applicator followed by applying the activatable material to the member wherein the activatable material is attached by way of a mechanical interlock via one or more through-holes.