Provided is an improvement in a method for manufacturing a slit carbon fiber bundle. The method for manufacturing a slit carbon fiber bundle of the present invention is a method including a step of forming a resin film on one surface of a flat carbon fiber bundle to obtain a single-sided coated carbon fiber bundle, and a step of partially slitting the single-sided coated carbon fiber bundle using a slitter roll to obtain a slit carbon fiber bundle, which has been split into sub-bundles, wherein in the step of slitting, the single-sided coated carbon fiber bundle contacts a circumferential surface of the slitter roll on a surface where the resin film has been formed.

A composite which comprises a first layer of a fibre reinforced polymer and a second layer of a fibre reinforced polymer, between which is an intervening layer comprising an array of thermoplastic islands.

A curable resin composition includes: an oxetane compound (A) having one oxetanyl group as a cationic polymerizable reactive group and at least one hydroxyl group; a cationic polymerizable compound (B) which is a cationic polymerizable compound other than the oxetane compound (A) and has two or more cationic polymerization reactive groups; a rubber particle (C); and a curing agent (D), wherein the oxetane compound (A) is contained at 30 parts by mass or more and 60 parts by mass or less, based on 100 parts by mass of total mass of the oxetane compound (A) and the cationic polymerizable compound (B), and the rubber particle (C) has a group capable of reacting with the oxetane compound (A) or the cationic polymerizable compound (B) on a surface of the rubber particle (C).

Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

The present invention relates to 3-D structures having high temperature stability and improved micro-porosity as well as processes of making and using same. The disclosed 3-D are advantageous because they have low densities and low permittivities. When compared to previous 3-D structures, the present structures maintain their low permittivities over a broader range of electromagnetic frequencies. Thus, when used in communication devices such as array antennas, can provided higher communication performance in high temperature environments.

A molding process of a co-cured short-fiber resin-based damping composite material and a molding part. Different from a traditional centrifugal processing process of a thin-walled tube of a resin-based composite material, the process uses raw materials including three kinds of materials with different densities and including two kinds of short-fiber epoxy resin with different densities and a damping material. During centrifugal molding, the three kinds of materials are made into fluids to be respectively injected at a uniform speed in three times according to the sizes of the densities. Layering is performed by using different centrifugal forces applied to the three kinds of materials. Co-curing is performed according to a resin curing process after the three kinds of materials are stably distributed, and a tubular thin-walled part of the embedded co-cured short-fiber resin-based damping composite material with a uniform wall thickness is obtained.

A structural reinforcement for an article including a carrier that includes: (i) a mass of polymeric material having an outer surface; and (ii) at least one consolidated fibrous insert (14) having an outer surface and including at least one elongated fiber arrangement having a plurality of ordered fibers arranged in a predetermined manner. The fibrous insert is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert and the mass of polymeric material are of compatible materials, structures or both, for allowing the fibrous insert to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier may be a mass of activatable material.

A method for fabricating a composite wing structural component for an aircraft is described. The method comprises extruding a filler material into each mold channel of a plurality of mold channels of a die to form a plurality of filler segments, removing the plurality of filler segments from the plurality of mold channels of the die, and arranging the plurality of filler segments in a space in the composite structural component, the space being defined by a radius of the composite structural component, such that the filler segments are in end-to-end contact. The method further comprises curing the plurality of filler segments in the space to fuse the plurality of filler segments.

A semiconductor device of embodiments includes: a die pad; a semiconductor chip fixed on the die pad; and a sealing resin covering the semiconductor chip and at least a part of the die pad. The sealing resin has a first protruding portion provided on one side surface and a second protruding portion provided on another side surface. The cross-sectional area of the first protruding portion is equal to or more than 10% of the maximum cross-sectional area of the sealing resin. The cross-sectional area of the second protruding portion is equal to or more than 10%; of the maximum cross-sectional area. The maximum cross-sectional area is equal to or more than 6 mm.sup.2.

Embodiments herein are directed to an assembly that includes a circuit board, a plurality of terminal pins, a first material layer, a second material layer, and a third material layer. The plurality of terminal pins extend from the circuit board. The first material layer encases a portion of the circuit board. The second material layer encapsulates a portion of the plurality of terminal pins and encases the first material layer. The second material layer defines a connector interface. A material of the second material layer is different from a material of the first material layer. The third material layer encases the first material layer and at least a portion of the second material layer. The third material layer defines a housing that is formed from a material different then the material of the first material layer and different from the material of the second material.