An embossing material that can be hardened and used for embossing lithography, comprised of a mixture of: at least one polymerizable main component, and at least one secondary component. The invention also relates to a use of the embossing material for the primary forming of an embossing form.

A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous -olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).

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Cured flexible sealant may be removed from a substrate if the cured flexible sealant includes within its volume a susceptor such as metal susceptor particles. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor. The consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.

Disclosed is a method for manufacturing a fire-resistant resin composition, a fire-resistant member manufactured from the composition, and a method for manufacturing the fire-resistant member, wherein fire-resistant members are installed in a wire penetration hole of a wall structure and, in the event of a fire, foam and expand by the heat of the fire to prevent the spread of the fire across the wall structure.

A thermosetting composition for injection molding comprising: (A) a compound represented by the following formula (A2) or (A3), and (B) a thermal polymerization initiator; wherein the composition further comprises no (G) titanium oxide or comprises (G) titanium oxide, when the composition comprises the component (G), the content of the component (G) is 5 parts by mass or less, based on a total of 100 parts by mass of components other than the component (B) and the component (C); and the composition comprises no polybutadiene di(meth)acrylate: ##STR00001##

Methods and compositions for processing polymers with fluorine-free polymer processing aids (PPAs) are described. The methods can include extruding a polymer composition, optionally with a masterbatch, wherein the polymer composition and/or the masterbatch comprises a fluorine-free PPA to make a polymeric film. The PPA comprises a mixture of one or more polyamides and one or more polyphosphites.