A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

An actuator includes: a cylinder, formed of carbon fiber reinforced polymer (CFRP), that extends along an actuator axis between a cylinder first end and a cylinder second end, and defines a cylinder inner diameter surface; a screw shaft that extends along the actuator axis between a screw shaft first end and a screw shaft second end, that is at least partially within the cylinder, and that is operationally connected, intermediate of the screw shaft first and second ends, to the cylinder second end; a screw shaft head affixed to the screw shaft first end, that in operation rotates relative to the cylinder, and that defines a screw shaft head outer diameter surface that faces the cylinder inner diameter surface with a slip fit therebetween; and a bearing ring affixed to the screw shaft head outer diameter surface, that is formed of polyether ether ketone (PEEK).

The invention relates to a poly(aryl-ether-ketone) (PAEK) powder, for use in a method for building objects layer-by-layer by electromagnetic radiation-generated sintering, said powder being characterized in that it is obtained from a thermal pretreatment at a temperature comprised between 260° C. and 290° C., preferably between 280° C. and 290° C., and in that it has a melting temperature which is stable, at the build temperature, and below or equal to 330° C., preferably below or equal to 320° C., and more preferably below or equal to 310° C.

An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.

The use of PEKK for lowering the CO.sub.2 and H.sub.2S permeability of a part intended to enter into contact with a petroleum effluent. Also, a pipe for transporting a petroleum effluent, including a layer intended to be in contact with the petroleum effluent, wherein the layer intended to be in contact with the petroleum effluent comprises PEKK and has a CO.sub.2 permeability at 130 C. of less than 10.sup.8 cm.sup.3, for a thickness of 1 cm and a surface area of 1 cm.sup.2 and per second and bar of CO.sub.2 pressure and/or an H.sub.2S permeability at 130 C. of less than 10.sup.8 cm.sup.3 for a thickness of 1 cm and a surface area of 1 cm.sup.2 and per second and bar of H.sub.2S pressure, the amount of CO.sub.2 and H.sub.2S being measured by GC, respectively. Lastly, a number of methods for manufacturing such a pipe.

The present invention is directed to material extrusion additive manufacturing processes, including fused filament fabrication, used to manufacture improved parts, devices, and prototypes using polyetherketoneketones (PEKK) and polyetheretherketones (PEEK). Using the improved processes of the invention, PEKK or PEEK polymer readily is 3D printed by FFF such that it crystallizes slowly enough during deposition for the resulting part to remain mostly or substantially amorphous during printing and thus have low percentage and/or more uniform shrinkage per layer and little to no warping from the base during print, and yet fast enough so that the resulting part crystallizes in post-print processing without substantial or any loss of its printed structure.

A flexible pipe designed to transport fluids that include, from the interior toward the exterior: an internal tubular sheath with an axis (A-A) defining an internal passage for fluid circulation; a composite reinforcing structure applied around the tubular sheath and connected to the tubular sheath; at least one sealing layer made of thermoplastic material applied around the composite reinforcing structure; at least one ply of tensile armor, not connected to the sealing layer, the at least one ply of tensile armor ply comprising at least one armor element wound around the sealing layer; the thickness of the sealing layer being less than 15 mm.

Impregnation of a fibrous material made from continuous fibres with a thermoplastic polymer matrix, the fibrous material comprising a thermoplastic sizing polymer and, before impregnation, an initial width. The method comprises an expansion step which is carried out by means of at least two tensioning members (E) and a heating system SC for heating the tensioning members and/or the fibrous material, the expansion being from 1.5 to 5 times the initial width. The expanded fibrous material is cooled below the Tg of the thermoplastic sizing polymer by means of a cooling system before being brought into contact with the thermoplastic polymer matrix.

A graft copolymer comprising: a core polymer comprising a crosslinked or non-crosslinked polysaccharide, a plurality of primary graft polymers covalently grafted to the core polymer, a plurality of secondary graft polymers covalently grafted to each primary graft polymer, an injectable dermal aesthetic formulation comprising such a graft copolymer and a method of preparing such a graft copolymer.

An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.