Provided are a metal clad laminate and a method for producing the same. The metal clad laminate at least includes a thermoplastic liquid crystal polymer film and a metal sheet bonded to each other, wherein the thermoplastic liquid crystal polymer film has a surface with a glossiness (20) of 55 or higher in accordance with JIS Z 8741 on the opposite side of the bonding surface to the metal sheet. The method for producing a metal clad laminate at least includes: providing a thermoplastic liquid crystal polymer film 2 and a metal sheet 6; and introducing the thermoplastic liquid crystal polymer film 2 and the metal sheet 6 between a pair of heating rolls so as to laminate them.

Provided are a metal clad laminate and a method for producing the same. The metal clad laminate at least includes a thermoplastic liquid crystal polymer film and a metal sheet bonded to each other, wherein the thermoplastic liquid crystal polymer film has a surface with a glossiness (20) of 55 or higher in accordance with JIS Z 8741 on the opposite side of the bonding surface to the metal sheet. The method for producing a metal clad laminate at least includes: providing a thermoplastic liquid crystal polymer film 2 and a metal sheet 6; and introducing the thermoplastic liquid crystal polymer film 2 and the metal sheet 6 between a pair of heating rolls so as to laminate them.

The present invention aims to provide an interlayer film for a laminated glass which is easily peelable without autohesion even after storage in a stacked state, and a laminated glass prepared using the interlayer film for a laminated glass. The present invention relates to an interlayer film for a laminated glass, having a large number of protrusions on at least one surface, the surface having an arrangement density of the protrusions of 3 protrusions/mm.sup.2 or more, and the protrusions having an area ratio of 15 to 75% to the surface.

A method of manufacturing a glass resin laminated body includes a step of sticking a glass film on a resin film via an adhesive layer while holding the glass film and the resin film between a first roller that presses against the resin film and a second roller that is disposed opposite to the first roller and that presses against the glass film. A ratio of an elastic modulus P1 of a surface layer of the first roller to an elastic modulus P2 of the resin film P1/P2 satisfies a relation of 310.sup.3P1/P21.0.

A method of manufacturing a glass resin laminated body includes a step of sticking a glass film on a resin film via an adhesive layer while holding the glass film and the resin film between a first roller that presses against the resin film and a second roller that is disposed opposite to the first roller and that presses against the glass film. A ratio of an elastic modulus P1 of a surface layer of the first roller to an elastic modulus P2 of the resin film P1/P2 satisfies a relation of 310.sup.3P1/P21.0.

Disclosed is an elastomeric bladder tool and related systems and methods. In one embodiment, the elastomeric bladder tool comprises an elastomeric inner layer substantially defining an inner cavity of the elastomeric bladder tool, an elastomeric outer layer substantially defining an outer surface of the elastomeric bladder tool, and a permeable middle layer positioned between the elastomeric inner layer and the elastomeric outer layer. The permeable middle layer has greater permeability than both the elastomeric outer layer and the elastomeric inner layer to allow for evacuating of gases that have entered the permeable middle layer.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

An apparatus and method for embossing a substrate are disclosed. For example, the apparatus includes an embossing platform, a printhead to dispense ink on the embossing platform in a desired raised pattern on the embossing platform, a press to apply a load against a substrate placed on the desired raised pattern and the embossing platform to emboss the desired raised pattern onto the substrate, and an ink removal device to remove the ink that is dispensed on the embossing platform in the desired raised pattern.

A method and apparatus for making pouches is disclosed. It includes using one or more of the following features: using two servo motors to drive a platen, providing a calibration routine is run at start-up and/or after the machine has been operating; controlling in response to feed back from the servo motor(s) such as feedback indicative of the distance the platen travels; the feedback is not of force exerted by the platen; and/or the platen is controlled to prevent unacceptable fracturing of the film laminate.