A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

The present invention provides for concentrated aqueous silk fibroin solutions and an all-aqueous mode for preparation of concentrated aqueous fibroin solutions that avoids the use of organic solvents, direct additives, or harsh chemicals. The invention further provides for the use of these solutions in production of materials, e.g., fibers, films, foams, meshes, scaffolds and hydrogels.

In an embodiment, a process for producing a functional-substance thin film material for which a required heating temperature for finishing is 100-130° C. is characterized in that a PP film 2 is releasably laminated to a surface of a PET film 1 with a non-silicone adhesive layer 3 so that the strength of adhesion of the PP film 2 by the non-silicone adhesive layer 3 is regulated so as to prevent the PP film 2 from suffering thermal deformation when a functional substance superposed in a thin film form on the other surface of the PP film 2 is heated to 100-130° C. in order to finally convert the functional substance into a functional-substance thin film material 4.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

A method of manufacturing a transport refrigeration unit is provided. The method includes providing an enclosure including an outer layer and a supporter. Providing the enclosure includes supplying one of a first material and a second material to a mold. This also includes supplying the other of the first material and the second material on the one of the first material and the second material that is supplied to the mold. Also, this includes curing the first material and the second material integrally that are supplied to the mold. The first material forms into the outer layer and the second material forms into the supporter. The second material includes a plurality of reinforcing fibers.

A cable passage for sealing and for electrically contacting an exhaust-gas sensor includes: a protective sleeve; and at least one connecting cable which is run out of the protective sleeve on at least one front side of the protective sleeve. At least one cross section of the space existing between the protective sleeve and the at least one connecting cable is filled with a thermoplastically workable fluoropolymer-containing material.

Machine direction oriented multilayer film suitable for preparing labels, comprising a core layer of a bimodal terpolymer and two outer layers comprising HDPE.

In at least one embodiment, a molding method for producing a molded article is provided. The method may include introducing polymer and fiber separately into an extruder in a first ratio to produce a first extruded material having a first fiber content and in a second ratio to produce a second extruded material having a second fiber content different from the first fiber content. The method may further include filling a first region of a mold with the first extruded material and a second region of the mold with the second extruded material. The extruded material may be formed as blanks for use in compression molding or may be introduced into an injection chamber for use in injection molding. The method may be used to form molded articles having a plurality of regions having different fiber contents.

A container capable of suppressing the unexpected opening of a pair of upper walls including a first side wall and a second side wall facing each other; a third side wall provided therebetween; a first upper wall and a second upper wall; and a locking member. The first side wall and the second side wall face each other. The first upper wall and the second upper wall are configured to be rotatable with respect to the first side wall and the second side wall, respectively. The locking member includes a fixed portion and an engagement portion, the fixed portion being fixed to the third side wall, the engagement portion being engaged with at least one of the first upper wall and the second upper wall to prevent the first upper wall and the second upper wall from opening.

A technique for stable, high-speed treatment of reinforcement fiber. In a state where a unidirectional fiber bundle is held between a supporting surface of a support and a pressing surface of a resonator ultrasonically vibrating in a pressing direction perpendicular to the supporting surface, a pressed part of the unidirectional fiber bundle pressed by the pressing surface is moved in a longitudinal direction of the unidirectional fiber bundle. By doing so, the unidirectional fiber bundle can be stably treated at high speed when the unidirectional fiber bundle is opened or impregnated with a resin.