A process for fabricating an optical device includes injecting (301) optical silicone into a mold cavity formed by two or more mutually matching mold-elements, curing (302) the optical silicone contained by the mold cavity, and separating (303) the mold-elements from the optical device constituted by the optical silicone. The reversible elasticity of the optical silicone after the curing phase is utilized in the process so that at least one of the mold-elements has counterdraft which causes a reversible deformation in the optical device when the mold-element is separated from the optical device. As the counterdraft is allowable, the shape of the optical device as well as the dividing joints between the mold-elements can be designed more freely. For example, walls of the mold cavity corresponding to optically active surfaces of the optical device can be arranged to be free from dividing joints between the mold-elements.

The present invention relates to lighting module, wherein a light exit window (12) of the lighting module is engraved such that the output color temperature of said lighting module is tuned. The present invention also relates to a method for tuning an output color temperature of a lighting module, said method comprising providing said lighting module comprising a light exit window (12), and a light source arranged to provide light having an optical path through said light exit window (12), said lighting module having a first output color temperature; and engraving a surface of said light exit window (12) such that the output color temperature of said lighting module is tuned to a second output color temperature.

Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.

[Object] To provide a chemical sensor capable of detecting light emitted from a detection target object efficiently, a method of producing the chemical sensor, and a chemical detection apparatus.

[Solving Means] A chemical sensor according to the present technology includes a substrate and a lens layer. On the substrate, at least one light detection unit is formed. The lens layer is laminated on the substrate and has optical transparency, and a lens structure is formed on a surface of the lens layer opposite to the substrate in a concave shape toward a lamination direction.

The present invention relates to an to an optical device comprising a micro-optical system and a retainer, and to a method for producing an optical device. In the case of the device according to the invention, the micro-optical system (10) is fastened in such a way that the micro-optical system is oriented in relation to a surface (50) of the retainer (60). The device is characterized in that the retainer (60) has a round, tapered recess (40) and the micro-optical system (10) is fastened on a spherical cap (20) and the spherical cap (20) is fastened to the retainer (60), wherein the spherical cap (20) at least partially protrudes into the recess (40) and lies against a partial surface (30) of the recess (40) or an edge (41) in the recess (40), wherein the spherical cap (20) is fastened to the retainer (60) in the recess (40), but is not fastened where the spherical cap lies in contact. Because the spherical cap lies in contact, shrinking of a fasting means cannot cause a shift or rotation of the spherical cap and thus cannot cause a misadjustment.

Techniques for generating electronics components that operate free of unwanted distortions such as edge diffraction and unwanted phase jumps are described. A modified production master or a modified working stamp can be implemented to generate an electronic or optical component having structures that are positioned within a desired distance from a planar surface. A production master or a working stamp is modified in dependence upon a comparison of an identified distance for each respective structure to the planar surface and a desired distance. The modified production master or the modified working stamp generates the electronic or optical component by positioning the structures in accordance with the desired distance. By positioning the structures in accordance with the desired distance, electronic components generated using the modified production master or the modified working stamp minimize distortions, such as a phase jump between the structures.

Resin compositions, layers, and interlayers comprising a poly(vinyl acetal) resin that includes residues of an aldehyde other than n-butyraldehyde are provided. Such compositions, layers, and interlayers can exhibit enhanced or optimized properties as compared to those formulated with comparable poly(vinyl n-butyral) resins.

Provided is an imprint apparatus that imprints a pattern formed on a mold onto a substrate. The imprint apparatus includes a substrate holder that holds the substrate and can move in a direction along the surface of the substrate; a gas supply unit for supplying a gas into a space between a pattern part of the mold and the substrate; and a wall part that is disposed so as to enclose the space that is supplied with gas, wherein at a position opposed to the substrate and the mold, the wall part faces the substrate holder or the substrate with a gap therebetween.

Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.

An optical bonding machine is provided, including a transparent datum located within the optical bonding machine, wherein the transparent datum supports a first substrate, a robotic placement head configured to pick up a second substrate and place the second substrate into contact with the first substrate, on the transparent datum, a camera disposed proximate the transparent datum, the camera capturing a video of a flow of an optically clear adhesive between the first substrate and the second substrate, and a curing source disposed proximate the transparent datum, the curing source emitting UV rays that pass through the transparent datum and the first substrate to cure an optically clear adhesive between a bonded substrate comprising the first substrate, the optically clear adhesive, and the second substrate. An associated method is also provided.