An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided.

The present disclosure relates to extrusion-coated structural systems including at least one extruded profile member coupled to and extending outwardly from an extrusion-coated structural member, as well as methods of making and using the same. Structural systems of the present invention that include at least one extruded profile member may exhibit enhanced flexibility, functionality, and/or durability. Structural systems according to embodiments of the present invention can be suitable for use in a variety of applications, including in ready-to-assemble furniture or cabinetry applications or as building and construction materials such as wall board, flooring, trim, and the like.

The present disclosure relates to extrusion-coated structural systems including at least one extruded profile member coupled to and extending outwardly from an extrusion-coated structural member, as well as methods of making and using the same. Structural systems of the present invention that include at least one extruded profile member may exhibit enhanced flexibility, functionality, and/or durability. Structural systems according to embodiments of the present invention can be suitable for use in a variety of applications, including in ready-to-assemble furniture or cabinetry applications or as building and construction materials such as wall board, flooring, trim, and the like.

A composite pipe structure including a pair of structural polymer layers disposed on opposed sides of a central metal layer. In a preferred embodiment, the thickness of the composite structure is comprised of approximately 40%-60% of the metal layer, with the remaining balance comprised of the pair of polymer layers.

A composite pipe structure including a pair of structural polymer layers disposed on opposed sides of a central metal layer. In a preferred embodiment, the thickness of the composite structure is comprised of approximately 40%-60% of the metal layer, with the remaining balance comprised of the pair of polymer layers.

For forming a sound absorption/insulation honeycomb panel by stacking an air-permeable material, a honeycomb material filled with a sound absorption material and a reflector, and adhesively joining these materials, it is hard to join the honeycomb material and the air-permeable material adhesively due to a thin wall surface of the honeycomb material and a resultant line to surface adhesive joint therebetween, causing a problem of low adhesive strength. By using a water absorption honeycomb material, an adhesive joint is formed with an adhesive joint area increased by dipping an end of a wall surface of a cell forming the water absorption honeycomb material into a water-soluble adhesive, making the end flexible over a fixed period of time, and then pressing the end strongly against an air-permeable material as a counterpart of the adhesive joint to deform a tip into an inverted T-shape.

A process of fabricating a shield, a process of preparing a component, and an erosion shield are disclosed. The process of fabricating the shield includes forming a near-net shape shield. The near-net shape shield includes a nickel-based layer and an erosion-resistant alloy layer. The nickel-based layer is configured to facilitate secure attachment of the near-net shaped to a component. The process of preparing the component includes securing a near-net shape shield to a substrate of a component.

A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.

A process of manufacturing a waterproof enclosure and sealing the waterproof enclosure includes the steps of forming a rectangular waterproof upper member and a rectangular waterproof lower member; forming four rectangular adhesive members; securing the adhesive members to the lower member by pressing and heating; securing three edges of the upper member to the lower member by pressing and heating to form a partially open enclosure having an open edge; punching a plurality of positioning holes on a periphery of the partially open enclosure; placing an article in the partially open enclosure by inserting the article through the open edge of the partially open enclosure; sealing the open edge of the partially open enclosure by pressing and heating to form a sealed enclosure; and cutting the periphery having the positioning holes to finish a waterproof enclosure.

The present invention relates to tools and system designs for chemical vapor deposition (CVD) systems and CVD synthesis used to deposit one or more thin film layers onto a flexible substrate or to grow nano-structured materials on large area flexible substrates and, more particularly, to scalable CVD coating and nanostructure manufacturing including CVD thin films and nano-structured materials such as nanotubes, nanowires and nanosheets.