B32B3/00

Method of manufacturing silicon carbide single crystal and silicon carbide single crystal substrate

Quality of a silicon carbide single crystal is improved. A crucible having first and second sides is prepared. A solid source material for growing silicon carbide with a sublimation method is arranged on the first side. A seed crystal made of silicon carbide is arranged on the second side. The crucible is arranged in a heat insulating container. The heat insulating container has an opening facing the second side. The crucible is heated such that the solid source material sublimes. A temperature on the second side is measured through the opening in the heat insulating container. The opening has a tapered inner surface narrowed toward the outside of the heat insulating container.

Heat-curable composition, dry film, and printed wiring board
09796810 · 2017-10-24 · ·

An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.

Insulating container

An insulating device can include an aperture having a waterproof closure which allows access to the chamber within the insulating device. The closure can help prevent any fluid leakage into and out of the insulating device if the insulating device is overturned or in any configuration other than upright. The closure also prevents any fluid from permeating into the chamber if the insulating device is exposed to precipitation, other fluid, or submersed under water. This construction results in an insulating chamber impervious to water and other liquids when the closure is sealed.

Method of making corrosion resistant and glossy appearance coating for light metal workpiece
09797036 · 2017-10-24 · ·

A metal workpiece, such as a wheel, and a method of providing an enhanced corrosion resistant surface coating on an exposed surface of a metal or alloy substrate (such as magnesium). A corrosion resistance basecoat is formed, including generating an oxide layer, and applying a first primer coating onto at least a portion of the oxide layer. The method may further include identifying highest corrosion prone areas on the substrate and designing a support rack that avoids contact with these corrosion prone areas. The method also includes forming a topcoat over at least a portion of the basecoat, by applying a second primer coating onto at least a portion of the first primer coating and depositing a sputtered metallic film onto the second primer coating using a physical vapor deposition technique. A clear coat layer may be applied over the metallic film.

System and method for additive manufacturing of an object
11254057 · 2022-02-22 · ·

A method of additive manufacturing of a three-dimensional object is disclosed. The method comprises sequentially forming a plurality of layers each patterned according to the shape of a cross section of the object. In some embodiments, the formation of at least one of the layers comprises performing a raster scan to dispense at least a first building material composition, and a vector scan to dispense at least a second building material composition. The vector scan is optionally along a path selected to form at least one structure selected from the group consisting of (i) an elongated structure, (ii) a boundary structure at least partially surrounding an area filled with the first building material, and (iii) an inter-layer connecting structure.

Multilayer housings

Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

Microporous composite sheet material
09790629 · 2017-10-17 · ·

A moisture vapor permeable, water impermeable composite sheet material is provided which is suitable for use as a housewrap material, and is also useful for other applications such as tarpaulins, or as covers for automobile, boats, patio furniture or the like. The composite sheet material includes a nonwoven substrate and an extrusion-coated polyolefin film layer overlying one surface of the substrate. The nonwoven substrate is comprised of polymeric fibers randomly disposed and bonded to one another to form a high tenacity nonwoven web. The nonwoven substrate has a grab tensile strength of at least 178 Newtons (40 pounds) in at least one of the machine direction (MD) or the cross-machine direction (CD). The extrusion coated polyolefin film layer is intimately bonded to the nonwoven substrate. The film layer has micropores formed therein to impart to the composite sheet material a moisture vapor transmission rate (MVTR) of at least 35 g/m.sup.2/24 hr. at 50% relative humidity and 23° C. and a hydrostatic head of at least 55 cm. In one embodiment, the nonwoven substrate comprises a spunbonded nonwoven fabric formed of randomly disposed substantially continuous polypropylene filaments. The spunbonded nonwoven fabric is an area bonded fabric in which the filaments are bonded to one another throughout the fabric at locations where the randomly disposed filaments overlie or cross one another.

Microporous composite sheet material
09790629 · 2017-10-17 · ·

A moisture vapor permeable, water impermeable composite sheet material is provided which is suitable for use as a housewrap material, and is also useful for other applications such as tarpaulins, or as covers for automobile, boats, patio furniture or the like. The composite sheet material includes a nonwoven substrate and an extrusion-coated polyolefin film layer overlying one surface of the substrate. The nonwoven substrate is comprised of polymeric fibers randomly disposed and bonded to one another to form a high tenacity nonwoven web. The nonwoven substrate has a grab tensile strength of at least 178 Newtons (40 pounds) in at least one of the machine direction (MD) or the cross-machine direction (CD). The extrusion coated polyolefin film layer is intimately bonded to the nonwoven substrate. The film layer has micropores formed therein to impart to the composite sheet material a moisture vapor transmission rate (MVTR) of at least 35 g/m.sup.2/24 hr. at 50% relative humidity and 23° C. and a hydrostatic head of at least 55 cm. In one embodiment, the nonwoven substrate comprises a spunbonded nonwoven fabric formed of randomly disposed substantially continuous polypropylene filaments. The spunbonded nonwoven fabric is an area bonded fabric in which the filaments are bonded to one another throughout the fabric at locations where the randomly disposed filaments overlie or cross one another.

Solder precoating method and workpiece for electronic equipment

Problem Precoating methods for previously adhering solder to areas to be soldered of a workpiece for an electronic part such as a printed circuit board, a chip part, or a wafer include the plating method, the hot leveling method, the solder paste method, the solder ball method, and the like. In these conventional precoating methods, solder did not uniformly adhere to areas to be soldered, solder did not completely adhere, and much equipment and time were required. The present invention provides a method which can perform precoating with uniform application and without the occurrence of defects using simple equipment and a workpiece to which solder is uniformly adhered. Means for Solving the Problem In the present invention, an excess amount of solder powder is dispersed atop an adhesive applied to a substrate, and then excess solder powder which is not adhered to the adhesive is removed. The surface on with solder powder is dispersed is then stacked on a workpiece to which flux is applied with the application of pressure, heating is then performed, and solder is adhered only to areas to be soldered.

Compound wherein conductive circuits can be made

To improve the characteristics of a compound adapted to create inside an electrically conductive track or area, the compound comprising a solvent, a polymer with double covalent conjugate bond, namely a heterocyclic compound formed by n carbon atoms and one atom of a different type linked in a ring structure; and a dispersion of conductive particles, there is added an agent adapted to slow down the precipitation of the conductive particles within the material.