A radiant panel includes a surface layer that is thermally conductive and includes exterior and interior surfaces. A first interior layer is electrically conductive and includes exterior and interior surfaces. The exterior surface of the first interior layer and the interior surface of the surface layer are coupled to one another. A second interior layer includes thermally insulative properties and a first rigidity. The second interior layer includes exterior and interior surfaces. The exterior surface of the second interior layer and the interior surface of the first interior layer are coupled to one another. A third interior layer includes thermally insulative properties and a second rigidity. The third interior layer includes exterior and interior surfaces. The exterior surface of the third interior layer and the interior surface of the second interior layer are coupled to one another. The second rigidity is greater than the first rigidity.

Floor panels have coupling parts in the form of a tongue and groove with locking surfaces. In a coupled state of two such panels, an open space is present, viewed vertically, between the tongue and the lower lip, and viewed horizontally, between the contact zone and the contact between the horizontally active locking surfaces. The underside of the tongue in the open space comprises a first face. The top side of the lower lip in the open space comprises a second face parallel to the first face. In the coupled state of two such panels, at least one face is perpendicular to the panel and intersects both the first face of the first coupled panel and the second plane of the panel coupled to the first panel.

An evaporator for an aerosol generating device is described. The evaporator comprises a heating body (101) comprising a plurality of channels (102) arranged through the heating body between an inlet surface (103) and an outlet surface (104). The channels are configured to transport liquid from the inlet surface through the heating body by capillary action. The heating body comprises electrically conductive material (120) and the evaporator further comprises circuitry (116) for providing a current through the electrically conductive material to provide resistive heating of the heating body to evaporate a liquid passing through the channels. The heating body and circuitry are configured to provide a positive temperature gradient across the heating body from the inlet surface to the outlet surface.

This disclosure includes high-temperature, thermally-insulative laminates, Some laminates have a front surface, a back surface, one or more heat-dispersing layers, each comprising at least 90% by weight of: a metal having a melting point of at least 1,300° C. and a thermal conductivity of at least 15 W/Km; or graphite, and one or more heat-insulating layers coupled to the heat-dispersing layer(s), the heat-insulating layer(s) each including a layer of polymeric aerogel, wherein at least a majority of the front surface is defined by one of the heat-dispersing layer(s).

One aspect of the present disclosure provides a composite body including: a nitride sintered body having a porous structure; and a semi-cured product of a thermosetting composition impregnated into the above-described nitride sintered body, in which dielectric breakdown voltage is 4.5 kV or higher.

A laminate that improves barrier properties of an atomic layer deposition film in spite of use of a substrate made of a polymer material, and provides a gas barrier film and a method of producing the same. The laminate includes: a substrate made a polymer material; an undercoat layer disposed on at least part of a surface of the substrate and made up of an inorganic material containing Ta; and an atomic layer deposition film disposed so as to cover a surface of the undercoat layer.

A laminate that improves barrier properties of an atomic layer deposition film in spite of use of a substrate made of a polymer material, and provides a gas barrier film and a method of producing the same. The laminate includes: a substrate made a polymer material; an undercoat layer disposed on at least part of a surface of the substrate and made up of an inorganic material containing Ta; and an atomic layer deposition film disposed so as to cover a surface of the undercoat layer.

A multilayer structure of the present invention is a multilayer structure including a base substrate and a semiconductor film that is made of α-Ga.sub.2O.sub.3 or an α-Ga.sub.2O.sub.3-based solid solution and has a corundum crystal structure, the semiconductor film being disposed on the base substrate. The semiconductor film has an average film thickness of greater than or equal to 10 μm. The semiconductor film is convexly or concavely warped. An amount of warpage of the semiconductor film is 20 μm or greater and 64 μm or less.

A covering element for raised floors, comprising a decorative component made of ceramic material, said decorative component having a top side, a bottom side opposite the top side and a thickness greater than 12 mm, wherein the covering element comprises a reinforcing component arranged underneath the bottom surface of the decorative component.

The present invention provides a graphene structure having graphene bubbles and a preparation method for the same. The preparation method comprises: providing a substrate; forming a hydrogen terminated layer on a top surface of the substrate and a graphene layer disposed on a top surface of the hydrogen terminated layer; and placing a probe on the graphene layer and applying a preset voltage to the probe, to excite a part of the hydrogen terminated layer at a position corresponding to the probe to convert into hydrogen, the hydrogen causing the graphene layer at a position corresponding to the hydrogen to bulge, so as to form a graphene bubble enveloping the hydrogen.