Patent classifications
B32B18/00
Systems, devices, and methods for manufacturing carbon ceramic brake discs
Systems, devices, and methods are provided for manufacturing a carbon ceramic brake disc. Generally, a plurality of uncured or partially-cured bulk molding compound preforms or molding compound layers and ventilation cores are placed in a mold cavity and warm-pressed at a first temperature. The ventilation cores are removed from the resulting cured green body. The cured green body is then removed from the mold, and treated through a polymer infiltration and pyrolysis or reactive melt infiltration process. Certain steps can be repeated until a desired target density or weight is attained.
Dielectric ceramic composition and ceramic electronic component
A dielectric ceramic composition including a first component and a second component. The first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %. The second component includes (by mass) at least (a) an oxide of Mn of 0.005% to 3.500% and (b) one or both of an oxide of Cu of 0.080% to 20.000% and an oxide of Ru of 0.300% to 45.000%.
CERMET AND/OR CERAMIC MULTI-COLOURED ARTICLE AND METHOD FOR MANUFACTURING SAME
A cermet and/or ceramic multi-coloured article, and in particular a bezel (1) of a timepiece, produced by a method for compressing at least two materials (2, 3) of distinct colours, the article including a relief decoration (8) of a different colour from the rest of the article, the decoration (8) being produced by laser ablation on one of the materials (3) after compression of the two materials (2, 3).
MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR SEMICONDUCTOR PROCESSING CHAMBER
A component for use in a semiconductor processing chamber is provided. A component body of a dielectric material has a semiconductor processing facing surface. A coating of a dielectric material is on at least the semiconductor processing facing surface, wherein the dielectric material of the component body has a same stoichiometry as the dielectric material of the coating.
Gypsum board with improved starch binder
Gypsum board having improved performance is obtained by controlling the distribution of starch in the gypsum core of the board and the gelling temperature of the starch. Starch migration in the board is controlled by the degree of acid-modification, to adjust the starch viscosity profile. The starch gelling temperature is controlled by chemical modification of the starch —OH groups.
Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators
Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example, bismuth vanadate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.
REINFORCED SANDWICH PANELS USING EXPANDABLE FOAM MATERIALS AND METHODS OF MAKING THE SAME
A reinforced sandwich panel, including two skin panels; a foam core disposed between the two skin panels; and an expandable framework disposed within the foam core.
REINFORCED SANDWICH PANELS USING EXPANDABLE FOAM MATERIALS AND METHODS OF MAKING THE SAME
A reinforced sandwich panel, including two skin panels; a foam core disposed between the two skin panels; and an expandable framework disposed within the foam core.
Ceramic electronic component and method of manufacturing the same
A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.
Method to produce a ceramic matrix composite with controlled surface characteristics
A method to produce a ceramic matrix composite with controlled surface characteristics includes: applying a scrim ply to a surface of a fiber preform, where the fiber preform includes silicon carbide fibers coated with boron nitride; infiltrating the fiber preform and the scrim ply with a slurry, thereby forming an impregnated ply on an impregnated fiber preform; infiltrating the impregnated fiber preform and the impregnated ply with a melt comprising silicon, and then cooling, thereby forming a ceramic matrix composite having a ceramic surface layer thereon, where the ceramic surface layer has a predetermined thickness and is devoid of boron; machining or grit blasting the ceramic surface layer to form an intermediate layer suitable for coating; and depositing an environmental barrier coating on the intermediate layer. Thus, a ceramic matrix composite coated with the environmental barrier coating is formed with the intermediate layer in between.