A reinforced composite comprises: a reinforcement material comprising one or more of the following: a carbon fiber based reinforcing material; a fiberglass based reinforcing material; a metal based reinforcing material; or a ceramic based reinforcing material; and a carbon composite; wherein the carbon composite comprises carbon and a binder containing one or more of the following: SiO.sub.2; Si; B; B.sub.2O.sub.3; a metal; or an alloy of the metal; and wherein the metal is one or more of the following: aluminum; copper; titanium; nickel; tungsten; chromium; iron; manganese; zirconium; hafnium; vanadium; niobium; molybdenum; tin; bismuth; antimony; lead; cadmium; or selenium.

A reinforced composite comprises: a reinforcement material comprising one or more of the following: a carbon fiber based reinforcing material; a fiberglass based reinforcing material; a metal based reinforcing material; or a ceramic based reinforcing material; and a carbon composite; wherein the carbon composite comprises carbon and a binder containing one or more of the following: SiO.sub.2; Si; B; B.sub.2O.sub.3; a metal; or an alloy of the metal; and wherein the metal is one or more of the following: aluminum; copper; titanium; nickel; tungsten; chromium; iron; manganese; zirconium; hafnium; vanadium; niobium; molybdenum; tin; bismuth; antimony; lead; cadmium; or selenium.

A structural reinforcement for an article including a carrier (10) that includes: (i) a mass of polymeric material (12) having an outer surface; and (ii) at least one fibrous composite insert (14) or overlay (960) having an outer surface and including at least one elongated fiber arrangement (e.g., having a plurality of ordered fibers). The fibrous insert (14) or overlay (960) is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert (14) or overlay (960) and the mass of polymeric material (12) are of compatible materials, structures or both, for allowing the fibrous insert or overlay to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier (10) may be a mass of activatable material (126). The fibrous insert (14) or overlay (960) may include a polymeric matrix.

A structural reinforcement for an article including a carrier (10) that includes: (i) a mass of polymeric material (12) having an outer surface; and (ii) at least one fibrous composite insert (14) or overlay (960) having an outer surface and including at least one elongated fiber arrangement (e.g., having a plurality of ordered fibers). The fibrous insert (14) or overlay (960) is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert (14) or overlay (960) and the mass of polymeric material (12) are of compatible materials, structures or both, for allowing the fibrous insert or overlay to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier (10) may be a mass of activatable material (126). The fibrous insert (14) or overlay (960) may include a polymeric matrix.

A composite structure includes a first fiber sheet, one or more second fiber sheet overlaying the first fiber sheet, a sensor, and two or more z-pins. The sensor is arranged between the first fiber sheet and the one or more second fiber sheet. The two or more z-pins extend through the first fiber sheet and the one or more second fiber sheet and are distributed about a periphery of the sensor to fix the one or more second fiber sheet to the first fiber sheet about the periphery of the sensor. Sensor arrangements and methods of making composite structures are also described.

A composite structure includes a first fiber sheet, one or more second fiber sheet overlaying the first fiber sheet, a sensor, and two or more z-pins. The sensor is arranged between the first fiber sheet and the one or more second fiber sheet. The two or more z-pins extend through the first fiber sheet and the one or more second fiber sheet and are distributed about a periphery of the sensor to fix the one or more second fiber sheet to the first fiber sheet about the periphery of the sensor. Sensor arrangements and methods of making composite structures are also described.

An example hose comprises: a core tube; a reinforcement layer surrounding the core tube and comprising basalt fiber; and a thermal insulation layer surrounding the reinforcement layer and comprising basalt fiber and/or carbon fiber.

The present invention relates to a process for the preparation of a composite for thermal insulation comprising at least layers (L1), (L2) and (LB), the process comprising the steps of providing layer (L1) containing from 25 to 95% by weight of aerogel and from 5 to 75% by weight of fibers and from 0 to 70% by weight of fillers and layer (L2) containing from 25 to 95% by weight of aerogel and from 5 to 75% by weight of fibers and from 0 to 70% by weight of fillers; applying a composition (C1) comprising an inorganic binder on one surface of the layer (L1) or layer (L2) or layer (L1) and (L2), and combining layer (L1) and layer (L2) in a manner that composition (C1) is located between layer (L1) and (L2), wherein composition (C1) is applied in the form of a, as well as a composite for thermal insulation comprising at least layers (L1), (L2) and layer (LB) which is located between layers (L1) and (L2) and the use of said composite for thermal insulation.

The present invention relates to a process for the preparation of a composite for thermal insulation comprising at least layers (L1), (L2) and (LB), the process comprising the steps of providing layer (L1) containing from 25 to 95% by weight of aerogel and from 5 to 75% by weight of fibers and from 0 to 70% by weight of fillers and layer (L2) containing from 25 to 95% by weight of aerogel and from 5 to 75% by weight of fibers and from 0 to 70% by weight of fillers; applying a composition (C1) comprising an inorganic binder on one surface of the layer (L1) or layer (L2) or layer (L1) and (L2), and combining layer (L1) and layer (L2) in a manner that composition (C1) is located between layer (L1) and (L2), wherein composition (C1) is applied in the form of a, as well as a composite for thermal insulation comprising at least layers (L1), (L2) and layer (LB) which is located between layers (L1) and (L2) and the use of said composite for thermal insulation.

A semiconductor device and method for fabricating same is disclosed. Embodiments are directed to a semiconductor device and fabrication of same which include a polycrystalline or amorphous substrate. An electrically conductive Ion Beam-Assisted Deposition (IBAD) template layer is positioned above the substrate. At least one electrically conductive hetero-epitaxial buffer layer is positioned above the IBAD template layer. The at least one buffer layer has a resistivity of less than 100 μΩcm. The semiconductor device and method foster the use of bottom electrodes thereby avoiding complex and expensive lithography processes.